-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
EMA Design Automation to Expand Reach into the Indian EDA Market
March 10, 2021 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation, a full-service provider and innovator of Electronic Design Automation (EDA) systems solutions, is partnering with Sunstream Global Technologies to expand their reach and provide Cadence system design solutions and support in India. Sunstream Global is an India-based company specializing in solutions and services for Electronic Design, Mechanical Design, Product Development, and associated IT services.
“As the need for collaboration among multinational engineering team increases, it became imperative we meet this demand,” said Manny Marcano, president and CEO of EMA Design Automation. “Our expansion into India marks a milestone as we open up to new opportunities, and we are excited to provide a value-added client relationship experience to an even larger audience.”
Companies with engineering teams in India are continuing to increase, making this expansion a natural progression for EMA. This partnership allows EMA to establish a local presence and engage directly with engineers in the same way they would with existing customers. Now companies will be able to directly benefit from EMA's proven track record of customer-first service and support.
Sunstream will carry out EMA's mission of supporting customers with the best service and products. “EMA is a driver of meaningful change within the EDA industry due to their customer first focus and technological expertise,” said Unni Mecheeri, CEO of Sunstream Global Technologies. “We're proud to be part of their team.”
Building on the success of a five-year-long relationship, this expanded collaboration will allow customers and partners in India to leverage the same cutting-edge technology and first-rate client experience EMA has been pioneering in North America for over 30 years.
“Unni and his team have helped EMA with numerous successful customer engagements,” said Marcano. “With their professionally trained and competent sales and support engineers, I am confident they will represent EMA professionally, and we will jointly provide new clients in India with true value-added sales and services”
To promote our entrance into this market, we are offering special pricing on the industry standard OrCAD PCB design software. This unprecedented offer in the Indian market serves to help all engineers regardless of budget get access to the professional grade tools, service, and support from Cadence and EMA they deserve. To
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.