-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
EMA Design Automation to Expand Reach into the Indian EDA Market
March 10, 2021 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation, a full-service provider and innovator of Electronic Design Automation (EDA) systems solutions, is partnering with Sunstream Global Technologies to expand their reach and provide Cadence system design solutions and support in India. Sunstream Global is an India-based company specializing in solutions and services for Electronic Design, Mechanical Design, Product Development, and associated IT services.
“As the need for collaboration among multinational engineering team increases, it became imperative we meet this demand,” said Manny Marcano, president and CEO of EMA Design Automation. “Our expansion into India marks a milestone as we open up to new opportunities, and we are excited to provide a value-added client relationship experience to an even larger audience.”
Companies with engineering teams in India are continuing to increase, making this expansion a natural progression for EMA. This partnership allows EMA to establish a local presence and engage directly with engineers in the same way they would with existing customers. Now companies will be able to directly benefit from EMA's proven track record of customer-first service and support.
Sunstream will carry out EMA's mission of supporting customers with the best service and products. “EMA is a driver of meaningful change within the EDA industry due to their customer first focus and technological expertise,” said Unni Mecheeri, CEO of Sunstream Global Technologies. “We're proud to be part of their team.”
Building on the success of a five-year-long relationship, this expanded collaboration will allow customers and partners in India to leverage the same cutting-edge technology and first-rate client experience EMA has been pioneering in North America for over 30 years.
“Unni and his team have helped EMA with numerous successful customer engagements,” said Marcano. “With their professionally trained and competent sales and support engineers, I am confident they will represent EMA professionally, and we will jointly provide new clients in India with true value-added sales and services”
To promote our entrance into this market, we are offering special pricing on the industry standard OrCAD PCB design software. This unprecedented offer in the Indian market serves to help all engineers regardless of budget get access to the professional grade tools, service, and support from Cadence and EMA they deserve. To
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.