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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Launches New Thought Leaders Program to Enhance Awareness on Electronics Industry Trends
March 11, 2021 | IPCEstimated reading time: 2 minutes
IPC has unveiled a new Thought Leaders Program in which industry experts will assist IPC on key industry issues and offer valuable insights to IPC members and key external stakeholders.
“IPC is building its leadership on the issues that are driving change for the electronics manufacturing industry,” said John Mitchell, IPC President and CEO. “As an association representing thousands of companies, we need to be astutely aware of a range of change drivers and how they are interconnected. IPC will leverage these experts’ insights to lead and influence change for the better.”
The Thought Leaders Program will be chaired by Mike Carano, an executive at RBP Chemical Technology and a member of IPC’s Hall of Fame.
“I’m thrilled and honored to coordinate the Thought Leaders Program and the work of this distinguished and diverse group of individuals,” said Mike Carano. “The industry is on the cusp of exciting change, and the thought leaders IPC has assembled will help guide the industry to new heights.”
IPC has retained a select group of experts to generate ideas and insights in five areas: education and workforce; technology and innovation; the economy; key markets; and environment, health, and safety. The Thought Leaders named today are:
- Mike Carano (Chair), VP of Technology & Business Development, RBP Chemical Technology
- Olivier Coulon, Consultant, Decision Etudes & Conseil
- Payman Dehghanian, Assistant Professor of Electrical and Computer Engineering, The George Washington University
- Bryan Erwin, Managing Partner, BlueWave Merchant Partners
- Denny Fritz, Consultant
- Savita Ganjigatti, VP of Engineering, Sienna Ecad Technologies
- Carol Handwerker, Professor of Materials Engineering, Purdue University
- Matt Holzmann, President, CGI Americas
- Meredith LaBeau, Director of Process Engineering, Calumet Electronics
- Joe O'Neil, CEO of Green Circuits
- Leslie Weinstein, Founder/CEO, CMMC Consulting
The Thought Leaders’ responsibilities will include providing publishable material in their subject areas; flagging opportunities for IPC engagement; and participating in quarterly roundtable discussions. Each expert is expected to fulfill at least one 12-month term, during which quarterly contributions will be expected.
One of the program’s first projects will be a report on the U.S. Defense Department’s Cybersecurity Maturity Model Certification (CMMC), an ambitious effort to better protect the cyber security of the defense industrial base. The electronics industry supports this initiative but has concerns about its ongoing implementation.
More information about the IPC Thought Leaders Program including a dedicated webpage will be available soon.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.