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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 12, 2021 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

There was a lot going on in the industry this week, and most of it happened at the virtual IPC APEX EXPO. Sure, it wasn’t the same as being in San Diego, but the show went pretty well, especially for a first-time event. There were a few technical snafus, but the IPC technical staff was responsive and took care of most of the issues right away. As I said a few months ago, how would you like to be in trade show management during a pandemic?
So, without further ado, here are my top five stories from the past week.
Karen McConnell: Recipient of the IPC Raymond E. Pritchard Hall of Fame Award
Published March 11
Congratulations to Karen McConnell, CAD CAM engineer with Northrop Grumman, for being inducted into the IPC Hall of Fame. In this interview, Patty Goldman, also an HOF inductee, chats with Karen about her long history as a PCB designer and her work on IPC committees. “I’m not afraid of asking the dumb question,” Karen explains. Words to live by. Let’s hear it for a PCB designer making it into the Hall of Fame.
IPC Managers Forum: Packed With Useful Information
Published March 9
The first day of IPC APEX EXPO featured the IPC Managers Forum, with a variety of presentations from managers across the industry. Gene Weiner, chairman of the Managers Forum, spoke with Barry Matties about some of the day’s highlights—everything from lessons learned during the pandemic through vertical integration and supply chain management. But above all, Gene stresses, the goal of the forum was to help managers learn to solve problems.
APEX Panel: Lessons Learned in Times of Crisis
Published March 10
Happy Holden brings us his review of a panel that took place during the EMS portion of the IPC Managers Forum at IPC APEX EXPO. Panelists Dave Patterson of Cirtronics, Katherine Ducharme of General Dynamics, Barb Jorgensen of AsperCore, Jonathan Rowntree of Rogers Corp, and Brad Bourne of FTG Group all agreed: During a crisis, communication is the key to keeping your business running smoothly. They also discussed future trends and the need to be adaptable when things start to go haywire.
IPC APEX EXPO 2021 Keynote: Travis Hessman on ‘The Great Digital Transformation’
Published March 10
Travis Hessman, editor-in-chief of IndustryWeek, delivered Wednesday’s keynote speech during IPC APEX EXPO, focusing on “The Great Digital Transformation.” In this article, Pete Starkey breaks down Travis’s five-step strategy for manufacturers to succeed in today’s world, and Pete explains that it’s “not as simple as throwing AI or IoT or robots at the problems.” Travis closes with some great advice, including “Develop processes, not disruptions.”
2021 Award Winners—IPC APEX EXPO 2021 Presentation
Published March 9
Nolan Johnson wrote this round-up of this year’s IPC APEX EXPO award winners. Let’s hear it for these folks who volunteered their free time to help improve this industry that we all love. Special recognition goes out to our IPC Rising Star Award winners, who are taking on leadership roles early in their careers; they represent the future of PCB design, manufacturing and assembly. Also, a big shout-out to our I-Connect007 columnists who made it into the winners’ circle, Michael Ford of Aegis and Jan Pedersen of Elmatica.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.