-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
March 17, 2021 | Cadence Design Systems, Inc.Estimated reading time: 3 minutes
Cadence Design Systems, Inc. announced the next-generation Cadence® Sigrity X signal and power integrity (SI/PI) solutions. Sigrity X features powerful new simulation engines for system-level analysis and includes the innovative massively distributed architecture of the flagship Cadence Clarity™ 3D Solver. The new Sigrity X tool suite addresses the size and scalability challenges of system-level simulations faced by today’s leading-edge technologists in the 5G communications, automotive, hyperscale computing, and aerospace and defense industries. Delivering up to a 10X performance gain for simulation speed and design capacity, Sigrity X also provides a new user experience that streamlines setup time for detailed system-level SI/PI analysis by transitioning seamlessly across different analysis workflows.
Additionally, the next-generation release works in tandem with the Clarity 3D Solver and is deeply integrated into Cadence’s Allegro® PCB Designer and Allegro Package Designer Plus. This enables PCB and IC package designers to incorporate end-to-end, multi-fabric, multi-board systems (from transmitter to receiver or power source to power sink) for SI/ PI signoff success.
“Cadence is dedicated to solving the most challenging system-level analysis problems with unprecedented speed and accuracy. Sigrity X delivers an extensive and comprehensive SI/PI analysis, optimization and signoff solution,” said Ben Gu, vice president of multi-physics system analysis in the Custom IC & PCB Group at Cadence. “Sigrity X is the most significant Sigrity breakthrough in the past decade, representing more than a rearchitected engine and transformed user interface. It’s a paradigm shift in customer productivity and SI/PI design insight.”
Endorsements
“Our continued success in the 5G mobile, home entertainment, networking and other industries depends on design and analysis tools that keep up with thriving markets and demanding time-to-market schedules. We work closely with the Sigrity team from Cadence and are very pleased to see the results being delivered in the next-generation Sigrity release. Not only can many designs be analyzed 10X faster with the same accuracy level, but the capability has also been extended to larger and more complex designs that previously could not be analyzed. This productivity builder is allowing us to cut weeks off our design cycles and expedite our product delivery,” said Aaron Yang, Senior Director at MediaTek.
“In a world with increasing speed and scale, there is a growing need to verify systems accurately and quickly in order to deliver Renesas products to the data center, industrial and automotive markets in a timely manner. Using the new Sigrity 2021 release, important processes for IC package signoff were improved dramatically; simulations that took more than a day to complete can now be completed in just a few short hours. We are excited about the adoption of this new technology, with a proven performance improvement of 10X, for our production designs,” said Tamio Nagano, Senior Principal Engineer, Design Automation Department, Shared R&D EDA Division, IoT and Infrastructure Business Unit at Renesas.
“We depend on fast and accurate modeling tools for the advanced IC packages we design for our foundry customers. Using the tightly integrated Allegro Package Designer Plus and Sigrity XtractIM tool combination from Cadence has been key to our many successes. The Sigrity 2021 release brings us the same level of accuracy from the Sigrity XtractIM field solver with performance that can allow us to deliver final design plans weeks earlier than before. Along with another 10X performance improvement from Cadence, we are looking forward to delivering a better product to our customers,” said Sangyun Kim, VP of Foundry Design Technology at Samsung Electronics.
“Our high-speed interfaces such as 56G SerDes and LPDDR5 must meet strict signal integrity requirements. Our design teams require that our PCB design and analysis tools work seamlessly. The combination of Cadence Allegro PCB design tools and Sigrity analysis tools gives us this seamless integration. We are now seeing ‘the X-factor’ with Sigrity technology. Sigrity X-Technology delivers up to 10X performance improvements over previous releases, significantly reducing the time required to analyze the PCB. We can now increase quality by iterating two or three more times and still meet our schedules. This ensures we have a robust product for our customers,” said David Dai, VP of H3C Semiconductor Technologies Co., Ltd.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
JAVAD EMS to Add New ESPEC Temperature Chamber to Support Growing Mil/Aero Work
04/28/2026 | JAVAD EMSJAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has ordered a new ESPEC EGNZ28-15NW temperature cycling chamber to expand its environmental testing capabilities as demand continues to grow in the military and aerospace sectors.
Global Turbine Asia Boosts Aerospace Growth and Talent Through Strategic Partnerships
04/21/2026 | ACN NewswireThe MoUs reflect GTA’s strategic focus on strengthening the aerospace and defence ecosystem through cross-border commercial cooperation, talent development, research partnerships and long-term capability building, aligned with evolving regional industry needs.
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
FTG Reports Strong Q1 2026 Results with Double-Digit Revenue Growth and Rising Backlog
04/09/2026 | Firan Technology Group CorporationIn Q1 2026, the Corporation grew organically. FTG is strategically investing its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. The company's achievements in Q1 2026 demonstrate this commitment, laying a strong foundation for future growth.