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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Agfa Appoints all4-PCB as New Distributor of its PCB Solutions in Western USA, Canada
March 17, 2021 | AgfaEstimated reading time: 1 minute
Agfa announces the appointment of all4-PCB as their new distributor to handle their PCB Solutions product range in the Western USA and Canada regions. The agreement includes the distribution of Agfa’s IdeaLINE phototooling films and DiPaMAT inkjet inks used in the production of printed circuit boards and metal structuring applications.
Frank Louwet, Business Unit Manager Electronic Print at Agfa, comments: “all4-PCB are a natural strategic partner for Agfa’s PCB solutions and have a wealth of expertise, knowledge and success in the PCB supply market. all4-PCB possess an especially strong background for introducing our new digital technology into the market. We are delighted to start working together”.
Torsten Reckert, President all4-PCB adds: “We are very pleased to be handling Agfa’s DiPaMAT range of inkjet solder mask, legend inks, and etch resist as well as the IdeaLINE phototooling film products. They complement very well our experience in the imaging areas of our PCB & Chemical Milling customer base. Being part of the technology transition from the traditional imaging processes using phototools and moving onwards toward inkjet solutions is very exciting. We look forward to a strong relationship with Agfa.”
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Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
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Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.