Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
The Chemical Connection: Common Misconceptions in Wet Processing
It’s Only Common Sense: Selling to Engineers
Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis Solution Paper
March 19, 2021 | PRNewswireEstimated reading time: 1 minute
Ansys received the Customers' Choice Award for a technical paper presented at TSMC 2020 North America Open Innovation Platform® (OIP) Ecosystem Forum. Within the paper, Ansys provided a roadmap for adding new technology to the Ansys® Totem™ RF design solution to address challenges in next-generation communication technologies beyond 5G, enabling customer success. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.
Transitioning to 5G millimeter wave wireless communication requires massive integration of RF components into digital SoCs (System-on-Chip). RF devices consume significant power and the resulting electromigration and self-heating challenges significantly impact the efficiency, cost and reliability of high-speed designs, which must be comprehensively addressed. Ansys enhanced Totem's capabilities to address the needs of 5G and high-speed RF designers.
Ansys' paper, titled "Electromigration and Self-Heat Analysis on RF Devices for mmWave Designs," details how Totem empowers 5G and high-speed RF designers to conduct electromigration and self-heat analysis. The Totem electromigration flow was demonstrated on an RF block using TSMC 16nm process technology and has been validated by TSMC.
"As a valued partner, Ansys provides leading design solutions that enable our mutual customers to take advantage of TSMC's latest process technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We are pleased to congratulate Ansys as the winner of this Customers' Choice Award and look forward to our continued collaboration with Ansys to address future complex challenges for designing next-generation silicon technologies."
"Together with TSMC, Ansys continues to help engineers overcome significant hurdles for designing 5G and high-speed RF chips," said John Lee, vice president and general manager at Ansys. "Receiving this prestigious award from TSMC for the second time in three years is a testament to the impact our industry-leading simulation solutions have made on the design community and we intend to deepen our collaboration with TSMC to solve more challenges in the near future."
Share on:
Suggested Items
HyRel Technologies Celebrates Future Innovators: Intern Program Empowers the Next Generation of Engineers and Professionals
05/01/2025 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Siemens Expands Global Electronics Intelligence Reach and Supplyframe Portfolio with Wevolver Acquisition
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced its intention to acquire Wevolver, expanding its audience reach, enhancing the Supplyframe product portfolio, and combining digital marketing and integrated campaign programs that include go-to-market support and content creation.