Trouble in Your Tank: Yield Improvement and Reliability
Dan's Biz Bookshelf: 'The Sale'
The Marketing Minute: Wired for Trust
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
May 1, 2025 | SEMIEstimated reading time: 2 minutes
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden. The Summit will offer insights into the latest heterogeneous integration innovations that are strengthening Europe’s semiconductor resilience and powering the next generation of intelligent systems. Registration is open.
3d system summitThemed Heterogenous Integration: Bolstering Europe's Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.
“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”
3D & Systems Summit Sessions
NextGen Talent: Empowering Careers, Driving Growth
Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.
Session 1: Geopolitical Dynamics and Market Trends
Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.
Session 2: Chiplet Applications: System Level Architectures
Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.
Session 3: Hybrid Bonding - Die to Wafer
Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.
Session 4: Hybrid Bonding - Wafer to Wafer
Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.
Session 5: Photonics and Co-Package Optics
Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.
Session 6: European Readiness: Design, Materials, Manufacturing
Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.
Global Leaders to Present
3D & Systems Summit presenters include experts from these global leaders:
- Adeia
- ASML
- Besi
- Bosch
- CEA-Leti
- Confovis
- ETEL S.A.
- European Semiconductor Manufacturing Company (ESMC)
- EV Group
- Fraunhofer
- imec
- Infinitesima
- Intel
- KLA
- Lam Research
- NXP Semiconductors
- RANOVUS
- SUSS MicroTec
- TechSearch International
- Yole Grou
Share on:
Suggested Items
SEMICON Southeast Asia 2025 Mega Show Opens in Singapore with Top Global C-suite Executives at Inaugural CEO Summit
05/21/2025 | SEMISEMICON Southeast Asia (SEA) 2025, the region’s flagship global electronics manufacturing and semiconductor supply chain event, officially opened today at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore.
Join the Conversation: MESI 4.0 Summit 2025
05/15/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
Join the Conversation: MESI 4.0 Summit 2025 Brings Manufacturing Experts to Porto
05/06/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/28/2025 | Andy Shaughnessy, I-Connect007I’ve spent my week recovering from a busy and interesting week in Anaheim for the 25th IPC APEX EXPO. I think back to my first APEX EXPO, and the changes since then are too numerous to count. I first attended in 2004, also in Anaheim, back when there was almost no design content in the conference or expo portions of the show. It was just a few years after the downturn, and attendees and exhibitors alike were skittish, almost afraid to show confidence in our industry. A few unemployed design friends handed out copies of their resumes. Travel budgets were still down, and the aisles weren’t exactly packed with traffic.