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Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
May 1, 2025 | SEMIEstimated reading time: 2 minutes
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden. The Summit will offer insights into the latest heterogeneous integration innovations that are strengthening Europe’s semiconductor resilience and powering the next generation of intelligent systems. Registration is open.
3d system summitThemed Heterogenous Integration: Bolstering Europe's Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.
“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”
3D & Systems Summit Sessions
NextGen Talent: Empowering Careers, Driving Growth
Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.
Session 1: Geopolitical Dynamics and Market Trends
Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.
Session 2: Chiplet Applications: System Level Architectures
Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.
Session 3: Hybrid Bonding - Die to Wafer
Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.
Session 4: Hybrid Bonding - Wafer to Wafer
Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.
Session 5: Photonics and Co-Package Optics
Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.
Session 6: European Readiness: Design, Materials, Manufacturing
Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.
Global Leaders to Present
3D & Systems Summit presenters include experts from these global leaders:
- Adeia
- ASML
- Besi
- Bosch
- CEA-Leti
- Confovis
- ETEL S.A.
- European Semiconductor Manufacturing Company (ESMC)
- EV Group
- Fraunhofer
- imec
- Infinitesima
- Intel
- KLA
- Lam Research
- NXP Semiconductors
- RANOVUS
- SUSS MicroTec
- TechSearch International
- Yole Grou
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Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
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