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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Virtual Zuken Innovation World Planned For August 4-5
March 25, 2021 | ZukenEstimated reading time: 1 minute
Zuken USA is finalizing plans to take its annual Zuken Innovation World (ZIW) Americas conference to a fully virtual platform in 2021.
“With continued concern about COVID-19 and ongoing corporate travel restrictions, it is not yet feasible to safely bring participants together in a face-to-face setting,” said Bob Potock, VP of Marketing at Zuken USA, Inc. “With safety in mind, we have made the decision to hold the ZIW Americas conference on a fully virtual platform.”
While the event will be held virtually, Zuken Innovation World will hold strong to its core tenets and offer participants opportunities for networking, learning, and innovation. Participants will be able to schedule one-on-one appointments with Zuken staff and with one another. Discussion rooms will be open throughout the event to network with others who share common interests. The Zuken-360 forum will provide participants with a chance to ask questions of the management and development teams. As an added bonus, registered participants will be able to replay conference sessions for an additional 60 days of education following the conference.
The annual conference will offer three technical tracks featuring topics focused on printed circuit board design, wire harness and cabinet design, and digital engineering. Classes will showcase how-to and best practices using the Zuken tool suites, as well as introduce innovative design methodologies and industry trends such as model-based engineering and architecture-driven engineering.
Registration is expected to open in April. For more information about participation in ZIW Americas, please contact the Conference Manager, Amy Clements, at 972-691-3284, amy.clements@zukenusa.com or visit www.zuken.com/us/event/ziw-americas/.
Zuken Innovation World Americas will return to an in-person format in 2022 and will take place June 6-9 in San Antonio, Texas.
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12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
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Spotlight on PEDC: Filbert Arzola
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