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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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Siemens White Paper: Multi-Board System Design
March 25, 2021 | Siemens EDAEstimated reading time: Less than a minute
The last decade has seen extraordinary advances in printed circuit board design and fabrication. There have been substantial advances across design, from schematic entry to simulation to layout and routing to team collaboration and even to the way that manufacturing data is transferred to the fabricator.
But there is one place where advancement has seemingly been stalled: the overarching system level hardware architecture design and connectivity.
This Siemens white paper explores the complexity of managing system-level PCB design and identifies methods for introducing the same level of integration and automation that has advanced other areas of PCB design over the last decade.
To read this white paper, click here.
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Sweeney Ng - CEE PCBSuggested Items
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