-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
CIRCUITS ASSEMBLY, PCD&F Announce 2021 NPI Award Winners
April 8, 2021 | UP Media Group Inc.Estimated reading time: 1 minute
CIRCUITS ASSEMBLY and PRINTED CIRCUIT DESIGN AND FAB announced the 2021 New Product Introduction Award winners for electronics assembly equipment, materials, software, and PCB fabrication.
The 14th annual NPI Awards recognize leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.
The winners are:
- Accu-Assembly - Component Storage (Accu-Stock)
- Accu-Assembly - Labeling Equipment (AccuID)
- Anda Technologies USA - Dispensing Equipment (iCoat-6)
- ASM Assembly Systems - Training Materials (ASM Academy Digital Training)
- Brady Corporation - Automation Tools (ALF19-XS Label Feeder)
- BTU International - Soldering – Reflow (Health Check Services)
- ECD - Selective Soldering Tools and Accessories (SelectiveRIDER)
- Elsyca - Plating (Elsyca CuBE)
- EVS International - Soldering – Alternative (EVS 18KLF)
- Hanwha Techwin Automation Americas - Component Placement – High-Speed (Decan S1)
- Henkel Corporation - Thermal Interface Materials (Bergquist microTIM mTIM 1000)
- Indium - Cored Wire (CW-232)
- Juki Automation Systems - Soldering – Selective (iCube HighFlex)
- Koh Young America - Software – Process Control (KSMART)
- Kyzen - Cleaning Materials (Aquanox A4382 OA)
- MacDermid Alpha Electronics Solutions - Soldering Materials (Alpha OM-372)
- MIRTEC - Test and Inspection – AOI (MV-6Z Omni)
- Omron - Test and Inspection – SPI (CKD VP9000)
- SelecTech - ESD (FreeStyle ESD Plus)
- Viscom - Test and Inspection – AXI (iX7059)
The awards were presented during a virtual ceremony.
“The competition was fierce, and the judges found some of the categories very difficult to decide,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY and PCD&F. “Clearly suppliers spent their year in Covid purgatory in a productive manner.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
Altus Announces Return of ‘Factory of the Future’ for 2026
05/11/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced the return of its ‘Factory of the Future’ event for 2026.
Kopin Secures $21.5M Follow-On Contract for U.S.-Made Thermal Imaging Assemblies
05/06/2026 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.
Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswireKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.