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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 9, 2021 | Andy Shaughnessy, I-Connect007Estimated reading time: 3 minutes

It’s that time again…the weekend. Fin de semana. Zh?umò. Wochenende. Didn’t this seem like a long week?
In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.
Spring is here, and I’m hoping to attend a live trade show soon. PCB East is set for June 15-17 in Marlborough, Massachusetts, but DesignCon has been moved back to August 16-18 in San Jose. What’s the Vegas spread on live conferences in 2021? But if enough people are vaccinated in the next few months, live events might become the norm again.
Siemens Introduces PCBflow
Published April 5
The integration of the Mentor tools into the Siemens hierarchy continues with the launch of PCBflow, which could be a real gamechanger for DFM. The Valor DFM platform powers the Siemens Xcelerator, creating an environment that allows designers to locate fabricators whose processes are better optimized for each OEM. DFM violations can be addressed during the design process, cutting DFM review time down to minutes. And there seems to be no learning curve here, with PCBflow primarily operating in the background.
Emerging Engineers: Audra Thurston
Published April 2
During the recent virtual trade shows in our industry, I’ve spoken with a few salty veterans (i.e., older than I am) who are hoping that all this virtual hooey is over with pretty soon so we can get back to traveling to shows and conferences. But what do the younger engineers think about the virtual format? In this article from our Show & Tell Magazine, Emerging Engineer Audra Thurston of Calumet Electronics explains why she’s a big fan of the virtual model, and why she hopes that our industry’s shows will adopt a hybrid plan—part live event, part virtual. People Audra’s age will be running the industry before you know it; will the virtual format become a permanent part of the trade show of the future?
Avishtech Introduces Latest Generation of Its Revolutionary Gauss 2D Field Solver Tool
Published April 6
Avishtech hasn’t been around very long, but the Silicon Valley company is already establishing itself as a player in the signal integrity tool arena. Avishtech recently introduced its Gauss Stack stackup tool, and now the company, founded by Keshav Amla, has launched the Gauss 2D field solver, which can predict resin starvation and provide board-level thermomechanical properties. This might be a company to watch in the future.
IPC-CFX-2591 Qualified Product Listing Achieves Major Milestone
Published April 5
IPC has reached a milestone in its efforts to provide an IPC-CFX-qualified equipment shopping list for companies seeking to become Smart Factories. The IPC-CFX-2591 QPL (qualified product listing) now contains 10 products from five companies; each product has passed a third-party virtual audit. The move to the Smart Factory continues.
Defense Speak Interpreted: Industrial Base Evaluation
Published April 6
In his latest column, Denny Fritz explains why the Department of Defense recently released an industrial strategy and not a battle plan. As Denny points out, every single DoD program of the future is affected by Defense’s ability to source PCBs—from trusted suppliers. And the U.S. is lacking in several areas—such as production of organic IC substrates—that are vital to the missions of tomorrow’s warfighters. It’s great having a columnist like Denny who can translate DoD documents into real-life information.
Suggested Items
IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.