-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Bridging the Simulation Tool Divide
April 12, 2021 | I-Connect007 Editorial TeamEstimated reading time: 3 minutes
Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.
Andy Shaughnessy: Hi, Todd. This is our simulation issue, and we want to get your thoughts on some of the challenges in this area. What do you see right now? What’s the biggest problem in simulation?
Todd Westerhoff: I think the biggest challenge is that there just aren’t enough people simulating. There are a lot of people who are designing to rules of thumb, manufacturer guidelines, or getting somebody else to run analysis for them—but there aren’t that many simulating themselves. I usually break simulation users into two broad groups: SI experts, who run simulations full time; and everyone else, who run simulations intermittently, if at all. The SI experts have the most advanced requirements and are also the smaller of the two groups.
The general assumption about simulation seems to be that it starts at the top—if we meet the analysis needs of the experts, knowledge and technology will trickle down over time to the broader audience. The problem is that, as an industry, we have too many designs in progress with too few experts to support all that activity. Simulation has two main purposes:
1. Providing a basis for making informed decisions about design trade-offs.
2. Validating a design before manufacture to reduce the risk of prototype spins.
How do we expect the majority of system designers to make decisions and reduce risk if they don’t have data to back up those decisions? Most of the simulation that we need to make design decisions and detect issues during layout doesn’t require expert-level attention to detail—the need is far more pedestrian. We’re not servicing those needs when we focus primarily on the state of the art. SI tools have been around for 30 years now, and we still see the majority of people not simulating, so we need to consider doing something else.
Shaughnessy: Maybe they don’t need a tool that you have to be an experienced signal integrity engineer to operate. Can a regular system designer or layout designer use the simulation tools we have today?
Westerhoff: Depending on the tools you talk about, yes and no. Let’s go back to our classes of users. Experts are looking for advanced tools with state-of-the-art performance and capacity. Ease of use is a consideration but not critical, as experts can make pretty much anything work. They have deep SI knowledge and can improvise analytical methods when the situation calls for it. To your question, the tools used by full-time SI/PI engineers are typically not usable by mainstream designers, because the tools by themselves are not enough. You need an analytical methodology, or workflow, to apply the tools to a design and determine whether the design will work, and that process is typically complicated enough (and manual enough) to preclude use by someone who isn’t performing analysis full-time.
And that’s the rub: if we’re not designing a 112-gigabit serial link or a loaded DDR5 interface, most of the issues we face during design and layout don’t require the kind of accuracy that an expert is looking for. There are a lot of design issues you want to take off the table before you put a lot of effort into modeling and simulation. You can think of it this way: Experts typically simulate at the level of accuracy needed to “sign-off” a design for fabrication, but system designers are often just trying to assess the impact of a tradeoff on design margin. In those cases, a good answer now is preferable to a great answer later. You can think of that as “trade-off” analysis. It’s less accurate, but faster to run and accessible to a wider audience. That’s the kind of analysis that needs to be accessible to regular system or layout designers. We have some of those tools in place today, but the world clearly needs more.
To read this entire interview, which appeared in the April 2021 issue of Design007 Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.