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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 23, 2021 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.
Columnist Michael Ford clarifies what the term “smart” means, and what it doesn’t. And Hu Yang of Zhongtai Securities has written a great feature that delves into the worldwide price increase of copper-clad laminates, which he predicts could rise to 20% in early 2021. Finally, we bring you the 2020 “Just Ask” Compilation, which features all your questions for some of our experts: Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes, as well as their answers. Don’t forget to bookmark this handy compilation!
I-Connect007 'Just Ask' Q&A Compilation Available Now
Published April 21
Last year, we asked readers to send in questions for a who’s who of industry experts: Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. Now, we have compiled all of your questions and the experts’ answers into one handy compendium for your easy access. And don’t forget to pose your questions for our next “Just Ask” series expert, “Trouble in Your Tank” columnist Mike Carano.
Altium’s New Cloud Platform Connects Electronics Industry Ecosystem
Published April 20
Altium continues to expand the technology around Altium 365. The new cloud-based platform Nexar allows design stakeholders to provide their software and services to existing users of Altium 365. After joining the Nexar community, fabricators, EMS companies, and component distributors and manufacturers can offer up-to-date information to PCB designers and engineers during the design cycle.
Cadence Acquires Pointwise to Expand System Analysis Offerings
Published April 16
Cadence moves further into system analysis with its acquisition of the computational fluid dynamics (CFD) development company Pointwise. The Pointwise mesh-generation technology reads in data from the leading CAD formats and will build upon Cadence’s Clarity and Celsius product line.
Time, Space, Structure, and Model Analysis of CCL Price Increase
Published April 19
Hu Yang of Zhongtai Securities Research Center authored this investigative article for our partners at PCB China Magazine. As Hu explains, prices of materials are expected to increase, possibly up to 20%, in 2021. He also describes the considerable bargaining power that our industry has regarding material cost.
Smart Is Not A Binary Concept
Published April 21
For all the talk about “smart” technology and processes, there’s still a lot of confusion about exactly what the term entails. Michael Ford comes to the rescue with this column that describes what “smart” is and what it is not. He provides a smart process IQ test to measure the intelligence of smart technologies, starting with the smartphone and continuing up through industry processes such as IPC-CFX.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.