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Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.

Elephantech, Logitech Together Drive Disruptive Electronics Innovation

05/01/2025 | Elephantech
Elephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.

SEL Receives Purdue Senior Design Partner of the Year Award

05/01/2025 | Schweitzer Engineering Laboratories
Schweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.

Discover the Future of AI in Test and Inspection in the May 2025 Issue of SMT007 Magazine

05/01/2025 | I-Connect007 Editorial Team
Are you ready to explore the cutting-edge advancements in AI shaping the electronics manufacturing industry through test and inspection? The May 2025 issue of SMT007 Magazine provides insights, innovations, and perspectives from today's top experts you won't find anywhere else.

IPC Excellence in Education Award: Zenaida Valianu

05/01/2025 | Nolan Johnson, I-Connect007
Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
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