The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Siemens’ Simcenter Portfolio Expands Capabilities for Frontloading CFD Simulation, Increased Productivity
May 4, 2021 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced the latest version of Simcenter™ FLOEFD™ software, a powerful CAD-embedded computational fluid dynamics (CFD) tool for design engineers. Simcenter FLOEFD software helps users frontload CFD simulation early into the design process to understand the behavior of their concepts. Due to its unique technology, it can reduce the overall simulation time by as much as 75 percent and it runs seamlessly inside NX™ software, Solid Edge® software, CATIA V5 and Creo. The latest version includes significant new functionality allowing designers to take advantage of a seamless working environment, as well as enhancements that extend thermal simulation capabilities and lighting applications. Simcenter FLOEFD is part of the Simcenter™ portfolio of simulation and test solutions within Siemens’ Xcelerator™ portfolio of integrated software and services.
Simcenter FLOEFD includes key improvements within process integration, allowing design engineers to implement CFD solutions within their workflow without requiring process changes. Simcenter FLOEFD for NX projects and results can now be fully managed in Teamcenter® software for added efficiency. New integrations with HyperLynx™ software, a suite of analysis and verification software for PCB engineers, allow for enhanced thermal analysis and more accurate simulation of printed circuit boards (PCBs) by taking into account joule heating phenomena.
The latest version of Simcenter FLOEFD also includes expanded capabilities based on Simcenter™ MAGNET™ software technology to increase accuracy of thermal simulation by considering electromagnetic phenomena. Direct integration of structural analysis allows CAD-centric users to easily apply CFD results to perform linear structural stress analysis of complex PCBs accurately. A new interface to Simcenter™ Nastran software allows easy transfer of CFD results for more sophisticated structural analysis in Simcenter™ 3D software. In addition, new enhancements for lighting applications include pulse-width modulation of a light source and the simulation of scattering and photoluminescence of phosphor particles, which are used during the manufacture of LEDs.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.