Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Siemens’ Simcenter Portfolio Expands Capabilities for Frontloading CFD Simulation, Increased Productivity
May 4, 2021 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced the latest version of Simcenter™ FLOEFD™ software, a powerful CAD-embedded computational fluid dynamics (CFD) tool for design engineers. Simcenter FLOEFD software helps users frontload CFD simulation early into the design process to understand the behavior of their concepts. Due to its unique technology, it can reduce the overall simulation time by as much as 75 percent and it runs seamlessly inside NX™ software, Solid Edge® software, CATIA V5 and Creo. The latest version includes significant new functionality allowing designers to take advantage of a seamless working environment, as well as enhancements that extend thermal simulation capabilities and lighting applications. Simcenter FLOEFD is part of the Simcenter™ portfolio of simulation and test solutions within Siemens’ Xcelerator™ portfolio of integrated software and services.
Simcenter FLOEFD includes key improvements within process integration, allowing design engineers to implement CFD solutions within their workflow without requiring process changes. Simcenter FLOEFD for NX projects and results can now be fully managed in Teamcenter® software for added efficiency. New integrations with HyperLynx™ software, a suite of analysis and verification software for PCB engineers, allow for enhanced thermal analysis and more accurate simulation of printed circuit boards (PCBs) by taking into account joule heating phenomena.
The latest version of Simcenter FLOEFD also includes expanded capabilities based on Simcenter™ MAGNET™ software technology to increase accuracy of thermal simulation by considering electromagnetic phenomena. Direct integration of structural analysis allows CAD-centric users to easily apply CFD results to perform linear structural stress analysis of complex PCBs accurately. A new interface to Simcenter™ Nastran software allows easy transfer of CFD results for more sophisticated structural analysis in Simcenter™ 3D software. In addition, new enhancements for lighting applications include pulse-width modulation of a light source and the simulation of scattering and photoluminescence of phosphor particles, which are used during the manufacture of LEDs.
Share on:
Suggested Items
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
04/24/2025 |Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
04/24/2025 | John Watson -- Column: Elementary, Mr. WatsonOn a flight, I can always tell when we begin our descent because that subtle drop in my stomach tells me the altitude has changed. Landing an airplane involves a gradual, precise process called the glide path. It descends at the correct speed and 3-degree angle to touch down smoothly and safely on the runway without bouncing or coming to a sudden stop. Pilots use specialized tools like the Instrument Landing System (ILS) or GPS to stay on the correct path. Lights on the ground, called PAPI lights, help pilots know if they are too high or too low.