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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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eCADSTAR 2021.0 Connects Electronic Engineering with PCB Design
May 6, 2021 | eCADSTAREstimated reading time: 1 minute
Zuken has launched eCADSTAR release 2021.0. With this release, eCADSTAR 3D PCB design has been extended to include numerous new features, including 3D creepage safety checks in the PCB design editor, improved bus management and sheet connector cross-references in the schematic editor and enhanced scripting in the COM interface.
The new creepage safety checking functionality makes eCADSTAR an ideal solution for the design of power supplies. Using creepage checks in the eCADSTAR PCB Design Editor, engineers can analyze the electrical safety of nets and defined regions of a PCB design, measuring the distance between electrical items across an insulating surface in 3D (according to standards, like IEC-62368). Creepage rules are controlled by the user in a common constraint browser in both the eCADSTAR Schematic and PCB Design Editor. Creepage safety checks are included in the eCADSTAR Advanced 3D and eCADSTAR Ultimate bundles.
“The fourth major release since the launch in September 2019 makes eCADSTAR one of the most modern PCB design solutions for SMEs bringing high performance at a competitive price," says Jeroen Leinders, eCADSTAR Business Manager Europe. "The next step will be the release of the eCADSTAR SPICE Controller linked with LTspice, a free electronic SPICE simulator provided by semiconductor manufacturer Analog Devices, scheduled for the second half of the year with eCADSTAR 2021.1."
The eCADSTAR SPICE controller will provide a tightly integrated engineering solution for the easy simulation of analog circuits within eCADSTAR Schematics, making eCADSTAR Schematic a single point for PCB design and simulation. Engineers will be able to view graphical waveforms, conduct what-if analysis, change discrete values, and run parameter sweeps using an embedded version of the free high-performance simulation software, LTspice, from Analog Devices. The eCADSTAR SPICE Controller is included in the eCADSTAR Advanced HS, eCADSTAR Advanced 3D, and eCADSTAR Ultimate bundles. It will be optionally available with eCADSTAR Schematic Editor (standalone) and the eCADSTAR Base bundle.
Configurations and pricing
eCADSTAR is available as a perpetual license or term-based license (TBL) and is easily configured to fit individual needs.
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Rachael Temple - AlltematedSuggested Items
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
EPTAC Expands. New HQ in Salem, NH, Draws Industry Leaders
04/30/2026 | EPTAC CorporationEPTAC, a global leader in electronics manufacturing training, has opened its new corporate headquarters and training facility in Salem, New Hampshire, expanding its capacity to support workforce development across North America.
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
Sanmina Reports Q2 Fiscal 2026 Financial Results
04/30/2026 | PRNewswireSanmina Corporation, a leading integrated manufacturing solutions company, reported financial results for the second quarter ended March 28, 2026 and outlook for its third fiscal quarter ending June 27, 2026.
Celestica Announces Q1 2026 Financial Results
04/30/2026 | CelesticaWe expect to grow revenue by more than $6.5 billion in 2026 based on our latest Annual Outlook, and we now expect to grow revenue significantly more than this in 2027, as a result of improved visibility and new program wins.