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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Lam Research, NY CREATES Partner to Train Future Semiconductor Workforce

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Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation

08/11/2026 | TSMC
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ESIA Reports Strong Momentum in Global Semiconductor Sales in Q2 2026

08/11/2026 | ESIA
The European Semiconductor Industry Association (ESIA) announced that strong momentum in global semiconductor sales continued into the second quarter of 2026, with worldwide sales surging 123.6% year over year (YoY) to US$403.3 billion.

Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030

08/11/2026 | Globe Newswire
The global advanced chip packaging technologies market is projected to grow from $38.6 billion in 2024 to $87.6 billion by 2030, at a compound annual growth rate (CAGR) of 14.8% over the forecast period.

Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.
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