Siemens Expands Industry-leading IC Verification Portfolio with Acquisition of Fractal Technologies
May 12, 2021 | PRNewswireEstimated reading time: 1 minute
Siemens Digital Industries Software announced that it has acquired Fractal Technologies, a provider of production signoff-quality IP validation solutions, based in the U.S. and the Netherlands. With this acquisition, Siemens' electronic design automation (EDA) customers can more quickly and easily validate internal and external IP and libraries used in their integrated circuit (IC) designs to improve overall quality and speed time to market.
Fractal's offerings include a comprehensive suite of IP validation and comparison checks used by top-tier foundries, IP providers, integrated device manufacturers and fabless semiconductor companies to accelerate time-to-tapeout and improve silicon results by enabling design data quality and integrity.
"Today's semiconductor design teams are seeking every possible advantage to deliver advanced, high-quality SoCs to market as rapidly as possible," said Ravi Subramanian, Ph.D., senior vice president, IC Verification, Siemens Digital Industries Software. "Our acquisition of Fractal Technologies, combined with the Solido product family, provides customers a tremendous advantage with a comprehensive IP validation solution that can speed design schedules, improve power, performance, and area (PPA) and identify sources of silicon failure before design tapeout."
Siemens plans to add Fractal's technology to the Xcelerator™ portfolio as part of its industry-leading suite of EDA IC verification offerings. Fractal's products will join the Solido™ software product family, including the Solido Characterization Suite, which remains the industry standard for machine-learning acceleration of IP validation and characterization. The machine learning technology within Solido enables variation-aware design and library validation for IP, from mature technologies to the most advanced, leading-edge process nodes.
"Semiconductor IP such as standard cells, memories, I/Os, and other specialized custom IP are the critical foundation upon which the world's chips are built," said Rene Donkers, chief executive officer for Fractal Technologies. "Being part of Siemens allows us to accelerate our R&D efforts, support a growing customer base, and further our vision to help enhance design closure predictability and turnaround time."
Siemens' acquisition of Fractal Technologies closed in May 2021. Terms of the transaction were not disclosed.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes to Advance Microelectronics Workforce Development
10/15/2025 | SEMIThe SEMI Foundation announced the official opening of the Regional Node Request for Proposals (RFP) for the National Network for Microelectronics Education (NNME), a national initiative funded by the U.S. National Science Foundation (NSF) to accelerate, expand, and improve microelectronics talent development across the United States.
The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come
10/15/2025 | BUSINESS WIRESemiconductor Research Corporation (SRC) is pleased to unveil the Microelectronics and Advanced Packaging (MAPT) Roadmap, crafted through the collective effort of approximately 300 individuals representing 112 organizations from industry, academia, and government.
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.