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Advanced Electronics Packaging Digest

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Tower Semiconductor, Semtech Expand SiGe Partnership for Data Centers

10/23/2026 | Tower Semiconductor
Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, and Semtech Corporation, a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (IoT) devices worldwide, announced an expanded multi-year agreement that builds on the companies’ 20-year partnership.

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

Global Electronics Association, Purdue University Establish Strategic Partnership to Advance Electronics Innovation

10/09/2026 | Global Electronics Association
The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.

Eylex Named Exclusive ANZ Distributor for INVISIO Communication Systems

09/28/2026 | INVISIO
Building on its longstanding history in mission-critical communications, Eylex is the exclusive in-country distributor for INVISIO’s full suite of tactical communications solutions across Defence and Public Safety as of September 28th 2026.

STANIA, Asahi Solder Partner to Strengthen Indonesia’s Tin Downstreaming

09/14/2026 | STANIA
PT Solder Tin Andalan Indonesia (STANIA), a subsidiary of PT Arsari Tambang, and Singapore Asahi Chemical & Solder Industries Pte. Ltd. (Asahi Solder) have signed a Memorandum of Understanding (MoU) to strengthen Indonesia’s tin downstreaming industry through the development of higher-value solder products, enhanced technology and quality capabilities, and expanded market access.
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