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OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.

DOCOMO, NTT, NEC and Fujitsu Develop Top-level Sub-terahertz 6G Device

04/12/2024 | JCN Newswire
NTT DOCOMO, INC., NTT Corporation, NEC Corporation and Fujitsu Limited jointly announced today the development of a top-level (1) wireless device capable of ultra-high-speed 100 Gbps transmissions in the 100 GHz and 300 GHz sub-terahertz bands.

NEC Develops 150 GHz Antenna-on-Chip Transmitter IC Chip for Beyond 5G/6G Radio Equipment

10/12/2023 | JCN Newswire
NEC Corporation has developed a 150 GHz transmitter IC chip and supporting technologies in preparation for Beyond 5G and 6G mobile access radio communication systems.

indie Semiconductor Extends Radar Leadership with World’s First 240 GHz Silicon Transceiver

08/28/2023 | Business Wire
indie Semiconductor, an Autotech solutions innovator, has launched the world’s first commercial fully integrated 240 GHz radar front-end (RFE) silicon transceiver.

DOCOMO, NTT Expand 6G Collaborations with Vendors Including Ericsson and Keysight

02/27/2023 | JCN Newswire
NTT DOCOMO, INC. and Nippon Telegraph and Telephone Corporation (NTT) announced that they will expand their 6G experimental trials with five world-leading vendors, including with newly added Ericsson and Keysight Technologies, Inc. as well as existing collaborators Fujitsu, NEC and Nokia.
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