-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Dynamic Source Manufacturing Selects MIRTEC 3D AOI
May 27, 2021 | MirtecEstimated reading time: 1 minute
MIRTEC is pleased to announce that Dynamic Source Manufacturing, Inc. has selected MIRTEC’s MV-6 OMNI 3D AOI machine to meet their high-quality manufacturing standards. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable DSM to achieve 100% customer satisfaction.
“For over 20 years, our global customers have counted on Dynamic Source Manufacturing (DSM) to bring their high-quality products to market quickly, efficiently, and with peace of mind. We proudly serve those in the communications, energy, industrial, automotive, security & defense, and emerging technologies markets,” stated Kevin Falenda, General Manager.
“As part of our commitment to continuous quality improvement, DSM recently purchased a MIRTEC MV-6 OMNI 3D AOI Machine. We have found that the MV-6 OMNI delivers advanced inspection capability allowing us to address sources of variation in real-time within our manufacturing processes. Beyond that, MIRTEC’s OMNI-VISION 3D Inspection Technology provides precise imagery, enhancing our overall experience and delivering a wow factor to our team!”
“We are extremely pleased with the defect detection capability, intuitiveness, and ease of programming of this advanced inspection system as well as the excellent customer service we have received thus far,” continued Falenda. “DSM is thrilled to partner with MIRTEC in pursuing our Industrial IoT and high-quality manufacturing goals. We are confident that this partnership will benefit our customers for many years to come.”
“A growing number of manufacturers are relying upon MIRTEC’s Technologically Advanced 3D SPI and AOI solutions to help increase profitability by improving production yields and reducing costly rework.” said Brian D’Amico, President of MIRTEC Corp. “We are very grateful to have been selected by Dynamic Source Manufacturing to meet their high-quality production standards. We look forward to a long and prosperous relationship between our organizations.”
MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.