-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm’s PWI Monitoring Tool – Perfect Profiling, Monitoring of Soldering Process
June 2, 2021 | Rehm Thermal SystemsEstimated reading time: 2 minutes

The new ProMetrics monitoring tool from Rehm Thermal Systems offers optimal control and top quality when soldering electronic assemblies.
With ProMetrics, Rehm Thermal Systems has developed an instrument for monitoring thermal profiles during soldering. It checks how well the previously created profile corresponds to the required, predefined specifications. The process window index (PWI) ascertained in this way is a statistical measure that quantifies the quality of a thermal process. This is mostly determined by the specification of the solder paste and the most heat-sensitive component. The following applies as a general rule: The lower the PWI, the better the profile and thus the more efficient and stable the process.
The generation of real-time data for each component allows the exact determination of the assembly position and reliably detects any deviations or delays in the soldering system. Process changes can thus be detected immediately. This leads to the greatest possible reliability in the calculation of the temperature profile of an assembly.
By integrating ProMetrics into the ViCON software, errors in data transmission to a higher-level system, such as MES, can be excluded and are available centrally in the MES for each assembly. Uniform logging in ViCON ensures the necessary transparency and traceability. Repeated maintenance of data is not necessary and the susceptibility to errors is significantly reduced.
A representation of the envelope curve visualises any deviations of the soldering profile from the specified parameters. Alarm messages in the ViCON show these deviations from the temperature profile outside the envelope curve.
In order to be able to use ProMetrics from Rehm Thermal Systems effectively, both software and hardware components are required for optimal quality control of the soldering profile. The Solderstar software with the associated licence dongle is used to record the data. The Solderstar software is integrated into the ViCON and helps with thermal profiling. Using a measurement data logger from Solderstar, temperatures of a reference board are recorded in order to be able to check the process stability of the system. The system is equipped with monitors to record the temperatures; in addition, the temperatures in the heating zones are recorded by sensors.
Temperature profiling with Solderstar equipment
With Solderstar, Rehm Thermal Systems gains from a competent partner boasting many years of expertise in this area for the creation and optimisation of temperature profiles during reflow soldering. The Solderstar PRO thermal profiling systems contain a compact data logger with Solderstar Smartlink connectors. The system transmits live profile data directly to Solderstar’s AutoSeeker software.
ProMetrics can be used for single and dual lane systems and is the first system in the world that is also suitable for vacuums.
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups. It specialises in thermal system solutions for the electronics and photovoltaics industry. We are a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customised systems. We have a presence in all key growth markets and, with more than 30 years of industry experience, we are able to implement innovative production solutions that set new standards.
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.