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Atotech Experts Will Present at Global Semiconductor & Electronics Forum
June 14, 2021 | AtotechEstimated reading time: Less than a minute
Atotech, a global supplier of specialty chemicals, equipment, software, and services announced that it will be presenting at the upcoming Global Semiconductor & Electronics Forum on Semiconductor innovation, Thursday, June 17, 2021.
Topic this year:
“Technology pushes limits – ECD and electroless deposition additives and tools for next generation advanced packaging” by Dr. Christian Ohde, Global Product Director for Semiconductor, Lead Frame and Connectors.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
MKS’ Atotech, ESI Showcase Next-gen PCB and Advanced Packaging Solutions at JPCA 2025
06/04/2025 | MKS’ AtotechMKS, through its leading surface finishing brand Atotech® and laser system brand ESI®, proudly announces its participation at the 2025 JPCA Show in Tokyo, Japan, from June 4–6. At booth 6D-01, the company will highlight the combined power of its strategic brands Atotech® and ESI®, showcasing the latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing.