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Advanced Electronics Packaging Digest

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Inspectis Enhances BGA Inspection with New Robust Stainless-Steel Micro Probe

09/03/2026 | INSPECTIS AB
Inspectis AB has introduced a new Micro-Size Optical Probe Tip for its Ball Grid Array (BGA) Inspection System, offering improved image quality and a more robust design for inspection of solder joints beneath today’s increasingly small BGA packages.

Bert Horner to Present Flying Probe Testing at Dallas SMTA Failure Analysis and Test Information Day

08/17/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that its President Bert Horner will share his extensive expertise in electronics manufacturing and test engineering at the Dallas SMTA’s upcoming Failure Analysis and Test Information Day, taking place Friday, September 4, 2026, from 11 a.m.-2:30 p.m. at Aboca’s Italian Grill in Richardson, Texas.

The Test Connection, Inc. Adds Experienced Test Engineer to Expand Flying Probe and ICT Capabilities

05/06/2026 | The Training Connection LLC
The Training Connection LLC (TTC-LLC) has hired Hermes Gonzalez as a Test Development Engineer, adding deep experience in flying probe and in-circuit test (ICT) to its engineering team.

EMI Strengthens Test Capability with Acculogic Flying Probe System

05/04/2026 | Express Manufacturing, Inc.
Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.

Controlar Introduces PicAI to Strengthen Probe Inspection in Electronics Manufacturing

04/16/2026 | Controlar
Controlar is bringing a new level of precision and control to electronics testing with the launch of PicAI (AI-Driven Probe Inspection Control), a fully automated system designed to replace manual ICT fixture verification in high-reliability environments.
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