-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Electronic System Design Industry Reports 17% Revenue Growth in Q1 2021
July 16, 2021 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 17% to $3.15 billion in Q1 2021, the strongest first-quarter growth ever, the ESD Alliance, a SEMI Technology Community, announced in the Q1 2021 Electronic Design Market Data (EDMD) report. The first-quarter revenue compares to $2.69 billion in Q1 2020. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15%, the highest annual growth since 2011.
“The industry reported substantial, double-digit year-over-year revenue growth for Q1 2021,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “All product categories significantly contributed, with double-digit growth in the Computer Aided Engineering (CAE), IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module (PCB and MCM), and Semiconductor IP (SIP) segments.”
“Geographically, the Americas; Europe, Middle East, and Africa (EMEA); and Asia Pacific (APAC) also reported double-digit growth,” Rhines said. “Q1 2021 marked a new high for quarterly growth of total license and maintenance revenue, as well as IC physical design and verification.”
The companies tracked in the EDMD report employed 49,024 people in Q1 2021, a 6.7% increase over the Q1 2020 headcount of 45,938 and up 1.1% compared to Q4 2020.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category
- CAE revenue increased 14% to $974.1 million compared to Q1 2020. The four-quarter CAE moving average increased 12.5%.
- IC Physical Design and Verification revenue surged 34.4% to $682.5 million compared to Q1 2020. The four-quarter moving average for the category rose 23.6%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 15.3% to $289.2 million compared to Q1 2020. The four-quarter moving average for PCB and MCM increased 5.3%.
- SIP revenue rose 12.9% to $1,113 million compared to Q1 2020. The four-quarter SIP moving average grew 17.1%.
- Services revenue increased 0.1% to $98.9 million compared to Q1 2020. The four-quarter Services moving average held steady with no growth.
Revenue by Region
- The Americas, the largest reporting region by revenue, purchased $1.28 billion of electronic system design products and services in Q1 2021, a 15% increase compared to Q1 2020. The four-quarter moving average for the Americas rose 13.5%.
- Europe, Middle East, and Africa revenue increased 14% to $447.3 million compared to Q1 2020. The four-quarter moving average for EMEA grew 6.7%.
- Japan revenue decreased 3.7% to $258.8 million compared to Q1 2020. The four-quarter moving average for Japan rose 4.3%.
- Asia Pacific revenue increased 26.9% to $1,166.3 million compared to Q1 2020. The four-quarter moving average for APAC increased 23.8%.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.