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TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

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TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

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06/19/2026 | PRNewswire
PCB Technologies, a global leader in advanced electronic and PCB manufacturing solutions, is pleased to report that during the past two weeks, until June 12, 2026, several orders have been placed with the company's PCB and Substrates Division by a leading customer in the European semiconductor equipment industry.

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Fujitsu Limited and IBM Japan, Ltd. announced that they will accelerate their collaboration in the field of business system modernization in order to advance enterprise digital transformation and address challenges associated with legacy systems.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.
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