-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Keysight PathWave Software Selected by Menlo Micro
July 19, 2021 | Keysight Technologies, Inc.Estimated reading time: 2 minutes
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that Menlo Micro has selected the company’s PathWave Advanced Design System (ADS) and Electromagnetic (EM) Design software to innovate advances in material science and develop high-performance microelectromechanical system (MEMS) switches.
Menlo Micro needed to resolve customer challenges relating to accurate 3D electromagnetic simulation and integrated design, test and measurement workflows in the development of its new MM5130, an ultra-low-loss radio-frequency (RF) SP4T switch, to address high-power switching applications up to 26 GHz. With an eye on time to market, Menlo targeted a short design cycle of three to four months.
Menlo Micro wanted to validate performance of its new MM5130 switch early in the development process, so it chose to implement its own PCB de-embedding algorithms into Keysight’s PathWave ADS software. “In choosing design tools, we needed to consider the whole flow, from the schematic to the 3D simulations,” said Dr. Xu Zhu, Menlo Micro’s director of technology. “Our engineers need to be familiar with the tools, and that is one of the reasons why we chose Keysight’s PathWave Advanced Design System as the core tool.”
Menlo chose Keysight’s EM Design software, including EMPro and RFPro, integrated into the PathWave ADS platform, to create a familiar design environment for their engineering team. Because the engineers were constantly changing and adjusting the layout in PathWave ADS, a smooth workflow from circuit layout to 3D EM simulation was critical.
Keysight’s EMPro and RFPro enabled Menlo to make smooth translations from the 2D layout to the 3D model files. Keysight’s RFPro, with the SmartMount and Mesh Domain Optimization technologies, solved the mesh optimization challenges. Menlo Micro’s design flow includes tools from multiple vendors, so interoperability was critical.
As a result, Menlo Micro was able to shorten the design cycle of its new MEMS switch by 65 percent with measurements correlating closely to simulation. Previous projects of this scale could take up to nine months. When comparing key banner specifications against other alternatives, Menlo Micro verified its innovative technology offered significant improvements in power density (SP4T 25 W power handling), RF insertion loss, linearity and ultra-low power consumption.
"Menlo Micro designed a complex, multi-technology module comprised of a wide range of geometries from micron-scale MEMs to millimeter-scale PCBs,” stated Tom Lillig, general manager of Keysight’s PathWave Design business. “Leveraging Keysight’s fast, high capacity, 3D EM circuit simulators they achieved a successful implementation in one pass.”
Menlo also created device prototypes and conducted measurements by wafer probing, which demonstrated first-pass manufacturing success. Next, their engineering team performed measurements on Keysight’s vector network analyzer (VNA) to compare its simulation results against actual de-embedded device measurements as a proof of concept for customers.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.