-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm's First Trade Fair Appearances in Germany
July 22, 2021 | Rehm Thermal SystemsEstimated reading time: 1 minute
Here we go again! Although trade fairs have already taken place in China and Russia in recent months, the first trade fairs in Germany that Rehm Thermal Systems will be taking part in are now coming up: Bondexpo in Stuttgart and productronica in Munich. The Rehm team is looking forward to in person visits once again.
Bondexpo is regarded as the leading trade fair for bonding technology and is an important industry meeting place for all aspects of industrial joining and bonding. From 5 to 8 October, exhibitors will be presenting themselves at the Stuttgart exhibition centre, including Rehm Thermal Systems with its product portfolio in the areas of dispensing, bonding technologies and application processes. With the clear and consistent focus of Bondexpo being on the joining/compounding process chain through bonding, potting, sealing and foaming, economical detailed and system solutions, Rehm solutions will be offered for the current and future challenges in the area of joining and compounding a wide variety of materials.
The electronics industry is constantly facing new challenges in the processing of sensitive electronic components. Rehm Thermal Systems offers suitable solutions and systems for these requirements, which will be presented at productronica in Munich. productronica is the world's leading trade fair for the development and production of electronics and will take place this year from 16 to 19 November at the exhibition centre in Munich.
You will receive more information about the systems that will be presented at Bondexpo and productronica at a later date. We are looking forward to welcoming you at our booth in Stuttgart and Munich!
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 30 years of industry experience, we implement innovative manufacturing solutions that set standards.
Suggested Items
Welcome to the Newest I-Connect007 Columnist Brittany Martin
01/14/2025 | I-Connect007 Editorial TeamIn today’s fast-paced world of electronics marketing, staying ahead of the curve requires creativity, strategy, and a deep understanding of evolving trends. Enter Brittany Martin, I-Connect007’s newest columnist and the voice behind "The Marketing Minute."
Würth Elektronik at PEDC 2025
01/14/2025 | Wurth ElektronikOn January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna.
Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
01/13/2025 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.
IKT Electronics Chooses TRI's X-ray Technology
01/13/2025 | TRIIKT Electronics, a leader in innovative electronics manufacturing, proudly announces the expansion of its production capabilities with the integration of Test Research, Inc.'s (TRI) cutting-edge X-ray inspection system, the TR7600F3D SII.
Global Automated Optical Inspection Systems Industry Revolutionize Electronics Manufacturing with Advanced Quality Control
01/13/2025 | Globe NewswireThe global automated optical inspection (AOI) system market is poised for substantial growth, with sales estimated at USD 849.5 million in 2024 and projected to reach USD 2,067.0 million by 2034.