Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity
Beyond Design: Integrated Circuit to PCB Integration
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming DownAnsys Announces Financial Results with Record Q2 ACV, Revenue
August 5, 2021 | ANSYSEstimated reading time: 1 minute
ANSYS, Inc. reported second-quarter 2021 GAAP and non-GAAP revenue growth of 16% in reported currency, or 13% and 14% in constant currency, respectively, when compared to the second quarter of 2020. For the second quarter of 2021, the Company reported diluted earnings per share of $1.06 and $1.85 on a GAAP and non-GAAP basis, respectively, compared to $1.11 and $1.55 on a GAAP and non-GAAP basis, respectively, for the second quarter of 2020.
"Ansys delivered exceptionally strong results for the second quarter and significantly beat our financial guidance across our key metrics. Our broad-based growth validates our strategy of Pervasive Simulation, and our product leadership and ongoing go-to-market momentum gives us increased confidence in our business and ability to execute against our goals. In July, we extended our technology leadership with Ansys 2021 R2, which introduced breakthrough technologies and innovative capabilities across our product portfolio. These enhancements are bolstering the value of Ansys simulation for our customers by providing them greater engineering insight with enhanced speed and scalability,” said Ajei Gopal, Ansys president and CEO.
Nicole Anasenes, Ansys CFO, stated, “Our outstanding performance was highlighted by 25% ACV growth in the second quarter, driving our first half 2021 ACV growth to 16%. Given the strength and momentum in our core business year-to-date, coupled with our sales pipeline, I am confident in our ability to achieve our increased full-year 2021 guidance.”
Share on:
Suggested Items
SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024
09/12/2024 | SEMIIn a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India.
Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities
09/11/2024 | ZukenZuken, a global leader in electrical and electronic digital engineering solutions, is proud to unveil the 2025 version of its industry-leading Harness Builder for E3.series software.
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.