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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Next-Gen Technologies

08/28/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced keynotes and program highlights for this year’s SEMICON® West on October 13–15 at the Moscone Center in San Francisco. Registration is open.

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

08/27/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX Hall 1 and 2 in Taipei, Taiwan.

MacDermid Alpha Addresses Advanced Packaging Materials Challenges at SEMICON Taiwan 2026

08/26/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will highlight materials and process technologies designed to address the performance, reliability and manufacturing challenges created by artificial intelligence (AI), high-performance computing (HPC) and increasingly complex advanced packaging architectures at SEMICON Taiwan 2026, September 2–4 at the TaiNEX Nangang Exhibition Center in Taipei.

Micron Opens State-of-the-Art Training Center in Boise to Strengthen America’s Semiconductor Workforce

08/26/2026 | Micron
Micron Technology Inc., the only U.S.-based manufacturer of memory and storage solutions, opened a 60,000-square-foot Micron Training Center (MTC) in Boise, a strategic investment to strengthen the skilled talent pipeline, support advanced semiconductor manufacturing and expand education and apprenticeship pathways in Idaho.

Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design

08/26/2026 | BUSINESS WIRE
Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, announced its expansion into Japan, one of the world's fastest-growing semiconductor markets.
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