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Koh Young America Participating at the SMTA Ohio Valley Expo & Tech Forum
August 9, 2021 | Koh Young AmericaEstimated reading time: 1 minute
In support of the SMTA and its local chapters, Koh Young America will be supporting the Ohio Valley Expo & Tech Forum Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio. Based on its award-winning portfolio of inspection and smart factory solutions, Koh Young will highlight its solder paste inspection (SPI) and automated optical inspection (AOI) processes.
At the SMTA event in Ohio, Isaiah Smith, Regional Sales Manager for Koh Young America will be onsite to discuss how True 3D inspection systems can improve production quality. Over the years, inspection systems have become an integral solution for the electronics manufacturing industry, but not all machines make the grade. For example, component miniaturization poses significant challenges, but true 3D-based systems can overcome the issues and improve yield.
During the event, attendees can discuss how to extract value from SPI, AOI, and other inspection technologies. Isaiah will introduce attendees to True 3D inspection and explain its essential role in manufacturing high-quality electronic boards. “With my production background as a Process Engineer at EMS providers in New England and my experience with a leading printer supplier, I am eager to share my unique insight about how SPI can improve manufacturing yields,” said Isaiah. “Many manufacturers simply use SPIs for pass/fail defect review. Few are actually performing data analysis.” Using parametric data from Koh Young inspection systems can help them characterize, optimize, and validate the process. Register today for the SMTA Ohio Valley Expo through www.smta.org.
If you cannot attend either event, you can still learn more about Koh Young and its best-in-class portfolio of True 3D smart factory solutions, powered by AI at www.kohyoung.com.
Be sure to download Koh Young's free eBook The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, published by I-Connect007, by clicking here.
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