Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Koh Young America Participating at the SMTA Ohio Valley Expo & Tech Forum
August 9, 2021 | Koh Young AmericaEstimated reading time: 1 minute
In support of the SMTA and its local chapters, Koh Young America will be supporting the Ohio Valley Expo & Tech Forum Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio. Based on its award-winning portfolio of inspection and smart factory solutions, Koh Young will highlight its solder paste inspection (SPI) and automated optical inspection (AOI) processes.
At the SMTA event in Ohio, Isaiah Smith, Regional Sales Manager for Koh Young America will be onsite to discuss how True 3D inspection systems can improve production quality. Over the years, inspection systems have become an integral solution for the electronics manufacturing industry, but not all machines make the grade. For example, component miniaturization poses significant challenges, but true 3D-based systems can overcome the issues and improve yield.
During the event, attendees can discuss how to extract value from SPI, AOI, and other inspection technologies. Isaiah will introduce attendees to True 3D inspection and explain its essential role in manufacturing high-quality electronic boards. “With my production background as a Process Engineer at EMS providers in New England and my experience with a leading printer supplier, I am eager to share my unique insight about how SPI can improve manufacturing yields,” said Isaiah. “Many manufacturers simply use SPIs for pass/fail defect review. Few are actually performing data analysis.” Using parametric data from Koh Young inspection systems can help them characterize, optimize, and validate the process. Register today for the SMTA Ohio Valley Expo through www.smta.org.
If you cannot attend either event, you can still learn more about Koh Young and its best-in-class portfolio of True 3D smart factory solutions, powered by AI at www.kohyoung.com.
Be sure to download Koh Young's free eBook The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, published by I-Connect007, by clicking here.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.