-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
FIH Mobile, Stellantis Establish JV to Deliver Cockpit Solutions for the Automotive Industry
August 24, 2021 | Globe NewswireEstimated reading time: 1 minute
Hon Hai Precision Industry Co., Ltd., together with its subsidiary FIH Mobile Ltd., and Stellantis N.V. announced that they have entered into a joint venture agreement. Mobile Drive, the joint venture entity, will focus on delivering a smart cockpit solution for vehicles that will disrupt current design conventions and foster the development of intelligent connected vehicles. This update comes after a Memorandum of Understanding (MOU) was initially signed on May 18, 2021.
Mobile Drive will be equally owned by Stellantis and FIH. The partnership has combined Foxconn’s capabilities in ICT industry and smart solutions, with Stellantis’ expertise in the automotive sector, ensuring the growth of Mobile Drive.
Mobile Drive will focus on developing infotainment and telematics solutions as well as a cloud service platform, which will aim to deliver a comprehensive smart cockpit solution. Its roadmap of software innovations will include artificial intelligence-based applications, navigation, voice assistance, e-commerce store operations, and payment services integration, amongst others. The hardware innovations will be related to the smart cockpit and telematics box.
Through the exchange of intellectual property by its founding entities and the vertical integration of respective supply chains, Mobile Drive will be able to create industry-leading automotive digital services to achieve a seamless user experience in and outside the vehicle. In the future, the smart cockpit solution will not only be available to all Stellantis vehicles, but also to third-party vehicle manufacturers, expanding the reach and impact of the Mobile Drive venture as it aims to be a global leader in smart cockpit and connected vehicle solutions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Infineon Further Extends Global Leadership in the Automotive Semiconductor Market
04/13/2026 | InfineonInfineon Technologies AG has once again proven to be the world’s leading automotive semiconductor supplier.
Compal Announces SYLUX Registration as a U.S. Company to Accelerate Automotive Safety
04/10/2026 | PRNewswireCompal Electronics announced that SYLUX is now officially registered as a United States company, marking a major milestone in the company's strategy to expand and accelerate its automotive business.
Polar Semiconductor Earns AS9100D Certification for Wafer Manufacturing
03/12/2026 | BUSINESS WIREPolar Semiconductor is pleased to announce that its Quality Management System (QMS) has achieved certification conforming to AS9100D and ISO 9001:2015 for the manufacture of semiconductor wafers.