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Winners of IPC Hand Soldering Competition at Instrutec in Tallin, Estonia Announced
September 22, 2021 | IPCEstimated reading time: 1 minute
In cooperation with the Instrutec tradeshow in Tallin, Estonia, IPC re-launched its popular Hand Soldering Competition, hosting skilled competitors on September 8-10 who demonstrated their expertise in hand soldering while competing for cash prizes. The first hand soldering held in-person since 2019, Instrutec welcomed 26 hand soldering experts representing eight electronics companies.
This year’s competition board was designed by French supplier Polygone CAO in accordance with IPC-A-610H criteria. Featuring 116 components as small as 0402 and 0603, the board provided a significant challenge to contestants, resulting in only five of 26 competitors completing the assembly within the time allotted, and only three of those boards functioning to specifications. IPC-A-610 Master Instructors from TPT- Tallinn Polytechnic School, the IPC licensed master training center in Estonia, served as the competition judges.
On the winner’s podium for Estonia:
First place: Timmo Antso, Scanfil OÜ, with a board at 556 points of 558 possible points, produced in 54 minutes. He received a certificate from IPC, a cash prize of €300, and a present from sponsor Almit.
Second place: Ivo Ellik, Scanfil OÜ, with a board at 518 points of 558 possible points, produced in 60 minutes. He received a certificate from IPC, a cash prize of €200, and a present from sponsor Almit.
Third Place: Karin Andressoo, Enics eesti AS, with a board at 556 points out of 558 possible points, produced in 60 minutes. She received a certificate from IPC, a cash prize of €100, and a present from sponsor Almit.
New this year –IPC Award to the Best Company Team
IPC and its partner, the Estonian Electronics Industries Association, presented a new award, recognizing the best company team in hand soldering. Companies with two or three competitors were automatically entered in the best company competition. The best company award was determined by the best scores of the contestants from that company. This year, eight companies competed, with the top prize going to: Estonia Scanfil OÜ, with the combined score of 1,074 against a maximum possible score of 1,116, completed within the total combined time of 114 minutes (maximum time allowed 120 minutes).
Next Competitions in Europe
Next Regional Competition in Europe will take place at productronica in Munich, Germany from November 16-19, 2021.
The IPC Hand soldering Competition will return to Estonia again next year (dates and location to be determined).
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.