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Advanced Electronics Packaging Digest

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Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

Infineon, Tack One Win SICC Award for Best Technological Collaboration

08/31/2026 | Infineon
Infineon Technologies Asia Pacific Pte Ltd and Tack One Pte Ltd have been recognized by Singapore International Chamber of Commerce (SICC)  as the winner of the “Best Technological Collaboration” category and as a finalist in the “Most Sustainable Collaboration” category at the 2026 SICC Awards ceremony, for their partnership in developing FloodFinder™, a smart urban flood monitoring system.

THECA 2026 Review: Innovating PCBs and Advanced Electronics

08/31/2026 | Marcy LaRont, I-Connect007
The Thailand Printed Circuit Association hosted its third annual trade show in the bustling city of Bangkok this past week, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.” Building on its success as a leading PCB industry exhibition, THECA has brought together the entire PCB value chain, creating a comprehensive platform for advanced electronics.

Mobix Labs’ Pending Drone Acquisition, Vision Aerial, Projects 93% Revenue Growth

08/31/2026 | BUSINESS WIRE
Mobix Labs, Inc., a provider of advanced technologies for aerospace, defense and other mission-critical markets, announced that Vision Aerial, Inc. , the American drone manufacturer Mobix Labs has signed a definitive agreement to acquire, is entering a new phase of commercial expansion as it advances the rollout of a new generation of American-built industrial drones and projects accelerating revenue growth through 2027.
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