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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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PCB Designers Can Compete to Become IPC Design Champion of 2022September 27, 2021 | IPC
Estimated reading time: 1 minute
IPC announces a new IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2022. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top contestants on January 25, 2022 at IPC APEX EXPO in San Diego, Calif.
The preliminary heat will be held November 1, 2021 to December 1, 2021, allowing designers to use their preferred tools to complete a full board buildup within 30 days. Provided with only a schematic and a BOM (bill of materials), competitors will be judged against their interpretation and implementation of design per IPC standards and general DFX (design for excellence) principles. Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2022.
“Every year, design engineers spend hours completing and perfecting their designs. The IPC Design Competition gives us the chance to meet those designers and put their skills to the test,” said Patrick Crawford, manager, design standards and related industry programs. “We can’t wait to see the results and crown a design champion at IPC APEX EXPO.”
Registration for the IPC Design Competition is free, but space is limited to 20 contestants. Registration ends October 29, 2021. For more information, visit www.ipc.org/ipc-design-competition-2022.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.