Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Zuken USA Opens Call for Papers for Zuken Innovation World 2022
October 5, 2021 | ZukenEstimated reading time: 2 minutes
Zuken USA, Inc, is now accepting abstracts for Zuken Innovation World Americas (ZIW) 2022, to be held June 6-9 in San Antonio, Texas. The annual user and technology event includes two and a half days of technical classes, a partner exhibition, and all of the networking benefits of the traditional in-person format. New this year, the event will be co-located with Vitech Integrate, an international symposium for digital engineering.
Digital Engineering will play a central role in the event. As companies look to digital engineering to address increasing product complexity and improve the product development process, they are looking for innovative solutions. The ZIW conference agenda will highlight the detailed design phase of the digital engineering process and how it connects to systems engineering.
Education and Innovation
Participants will have the opportunity to choose from more than 40 technical classes across 3 dedicated tracks. Zuken University classes return at the 2022 event showcasing how-to and best practices for current and upcoming product releases. By adding a half day, the agenda expands to offer a selection of deep dive classes and additional partner sessions. Zuken’s popular Expert Bar returns with one-on-one appointments with Zuken’s technical experts. ZIW and Vitech Integrate will share a common Technology Showcase, allowing technology partners to share their innovative complementary solutions in an interactive setting that encourages networking.
Abstract Submission
Abstracts are now being accepted for 45-minute technical presentations. The agenda consists of three tracks focused on the following areas:
- Digital Engineering initiatives and best practices including model-based design and the digital thread
- Board-based system design that includes architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical-based system design including wire harness and panel for the transportation, power, special vehicles, and aerospace and defense industries.
Presentations must be noncommercial in nature and should focus on technology, techniques, or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 300 words, along with speaker biographies should be submitted to Zuken by December 31, 2021. For additional details and deadline information, visit the ZIW event page or contact the Conference Manager, Amy Clements.
Additional upcoming ZIW events include:
- May 3-4, 2022 – Darmstadium, Germany
- June 3, 2022 – Lucerne, Switzerland
- June 14, 2022 – Bologne, Italy
- June 16, 2022 – Paris, France
- September 29, 2022 – Birmingham, United Kingdom
- October 2022 – Yohohama, Japan
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
IBM, Aramco Explore Collaboration to Accelerate AI and Innovation Across Saudi Arabia
05/07/2026 | IBMAramco and IBM announced their intended collaboration on opportunities to advance artificial intelligence, agentic AI, automation, material science and other mutually agreed domains in the industrial sector.
Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
05/07/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfEvery once in a while, a book comes along that doesn’t just make you think, it makes you sit up straighter and ask: Why aren’t we doing this better? "Abundance" is exactly that kind of book. When so much of our national conversation revolves around scarcity—housing, energy, infrastructure, and opportunity—authors Ezra Klein and Derek Thompson flip the script. They argue, persuasively and intelligently, that America’s real problem isn’t a lack of ideas. It’s a lack of execution.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Bosch Executive Erik Rein Elected New President of ESIA
04/21/2026 | ESIAOn 20 April 2026, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered to elect Erik Rein, Executive Vice President and Board Member Mobility Electronics responsible for semiconductor business at Bosch, as the organisation’s new President.