Beyond Design: The Fundamental Structure of Spectral Integrity
Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Zuken USA Opens Call for Papers for Zuken Innovation World 2022
October 5, 2021 | ZukenEstimated reading time: 1 minute
Zuken USA, Inc, is now accepting abstracts for Zuken Innovation World Americas (ZIW) 2022, to be held June 6-9 in San Antonio, Texas. The annual user and technology event includes two and a half days of technical classes, a partner exhibition, and all of the networking benefits of the traditional in-person format. New this year, the event will be co-located with Vitech Integrate, an international symposium for digital engineering.
Digital Engineering will play a central role in the event. As companies look to digital engineering to address increasing product complexity and improve the product development process, they are looking for innovative solutions. The ZIW conference agenda will highlight the detailed design phase of the digital engineering process and how it connects to systems engineering.
Education and Innovation
Participants will have the opportunity to choose from more than 40 technical classes across 3 dedicated tracks. Zuken University classes return at the 2022 event showcasing how-to and best practices for current and upcoming product releases. By adding a half day, the agenda expands to offer a selection of deep dive classes and additional partner sessions. Zuken’s popular Expert Bar returns with one-on-one appointments with Zuken’s technical experts. ZIW and Vitech Integrate will share a common Technology Showcase, allowing technology partners to share their innovative complementary solutions in an interactive setting that encourages networking.
Abstract Submission
Abstracts are now being accepted for 45-minute technical presentations. The agenda consists of three tracks focused on the following areas:
- Digital Engineering initiatives and best practices including model-based design and the digital thread
- Board-based system design that includes architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging
- Electrical-based system design including wire harness and panel for the transportation, power, special vehicles, and aerospace and defense industries.
Presentations must be noncommercial in nature and should focus on technology, techniques, or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 300 words, along with speaker biographies should be submitted to Zuken by December 31, 2021. For additional details and deadline information, visit the ZIW event page or contact the Conference Manager, Amy Clements.
Additional upcoming ZIW events include:
- May 3-4, 2022 – Darmstadium, Germany
- June 3, 2022 – Lucerne, Switzerland
- June 14, 2022 – Bologne, Italy
- June 16, 2022 – Paris, France
- September 29, 2022 – Birmingham, United Kingdom
- October 2022 – Yohohama, Japan
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
CoreWeave Posts £1.5 Billion Commitment to Power UK AI Innovation and Growth Through Sustainable Computing
09/17/2025 | BUSINESS WIRECoreWeave, Inc. the AI Hyperscaler™, announced the next £1.5 billion phase of its investment in AI data centre capacity and operations in the United Kingdom, bringing the total investment in the country to £2.5 billion.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.