-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Skills Challenge Competitions Return to India Region
October 13, 2021 | IPCEstimated reading time: 1 minute

To commemorate IPC India’s decade of service to the electronics manufacturing industry, the IPC India team will hold skills challenge competitions and member networking events starting this November across different parts of the country. Winners of regional competitions will gather in Bengaluru and New Delhi in August 2022 to compete in PCB design, hand soldering and wire harness assembly championships.
The skills challenge semi-final competition will take place on August 2 (Bengaluru) with championship taking place on August 4 (New Delhi) at Integrated Electronics Manufacturing Interconnections (IEMI) 2022. In addition to the skills championships, panel discussions and technical conference program sessions will focus on information communication technology on August 2 and on August 4, topics and discussions will focus on the defense and aerospace technology.
IPC Skills Challenge Phases:
November 2021 – March 2022
- Competitors from electronics companies send registration form to IPC India
- As per IPC competition guidelines, companies organize hand soldering/wire harness assembly/PCB design challenges at their company premises using own tools/equipment
- Companies can nominate observers/judges from own company if IPC certified individuals available, otherwise IPC will provide IPC certified observers/judges
- IPC present certificates to winner and runner up at each company location
April 2022 – July 2022: IPC India will organize semi-final competition round with the winners of the first rounds at networking events at Hyderabad, Chennai, Pune, Bengaluru, Colombo (TBC) and New Delhi (August 2, 2022)
August 4, 2022: Final Round to be played in Bengaluru.
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.