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IPC Skills Challenge Competitions Return to India Region
October 13, 2021 | IPCEstimated reading time: 1 minute

To commemorate IPC India’s decade of service to the electronics manufacturing industry, the IPC India team will hold skills challenge competitions and member networking events starting this November across different parts of the country. Winners of regional competitions will gather in Bengaluru and New Delhi in August 2022 to compete in PCB design, hand soldering and wire harness assembly championships.
The skills challenge semi-final competition will take place on August 2 (Bengaluru) with championship taking place on August 4 (New Delhi) at Integrated Electronics Manufacturing Interconnections (IEMI) 2022. In addition to the skills championships, panel discussions and technical conference program sessions will focus on information communication technology on August 2 and on August 4, topics and discussions will focus on the defense and aerospace technology.
IPC Skills Challenge Phases:
November 2021 – March 2022
- Competitors from electronics companies send registration form to IPC India
- As per IPC competition guidelines, companies organize hand soldering/wire harness assembly/PCB design challenges at their company premises using own tools/equipment
- Companies can nominate observers/judges from own company if IPC certified individuals available, otherwise IPC will provide IPC certified observers/judges
- IPC present certificates to winner and runner up at each company location
April 2022 – July 2022: IPC India will organize semi-final competition round with the winners of the first rounds at networking events at Hyderabad, Chennai, Pune, Bengaluru, Colombo (TBC) and New Delhi (August 2, 2022)
August 4, 2022: Final Round to be played in Bengaluru.
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Brent Fischthal - Koh YoungSuggested Items
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American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
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Variosystems Strengthens North American Presence with Southlake Relaunch 2025
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Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
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