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Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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IPC Online Course: PCB Design for Advanced Packaging
November 4, 2021 | IPCEstimated reading time: Less than a minute
IPC will be holding an online training course focused on PCB design for advanced packaging. This course provides the skills necessary to create PWB/PBA designs that require advanced or complex packaging. These include boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing, non-standard board outline geometry, non-standard board mounting, and advanced board materials.
This training course, which will run every Monday and Wednesday from Nov 8– December 15, 2021 (6:30 p.m.–8:00 p.m. EST).
Suggested Items
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.
DesignCon 2025: Looking Great at 30
01/30/2025 | Andy Shaughnessy, Design007DesignCon may be turning 30 this year, but the Silicon Valley staple doesn’t look a day over 25. Attendees turned out for this celebratory bash, many of them reminiscing about their first DesignCon event 20 or 30 years ago. The Tuesday night welcome reception was basically a 30th birthday bash, sponsored by Mouser. Show managers went all out, with strobe lights and a DJ blasting a mix of old and new dance tunes. That was fitting, because I spoke with engineers from ages 21 to 81 at DesignCon this year. Nice to see more younger folks each year.
Istvan Novak Looks Back on History of DesignCon
01/29/2025 | Andy Shaughnessy, Design007 MagazineMany of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
01/29/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.