Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Altair Names Origin Engineering Solutions as Channel Partner for the United Kingdom, Ireland
November 8, 2021 | AltairEstimated reading time: 1 minute
Altair, the global leader converging simulation, HPC, and AI, added a new channel partner to its growing ecosystem in the UK and Ireland with Origin Engineering Solutions, based in Birmingham, UK. Origin Engineering Solutions will offer Altair’s manufacturing simulation software solutions throughout the UK and Ireland.
Origin Engineering Solutions provides and supports computer-aided design (CAD) and simulation software solutions to the manufacturing sector, which improves design outputs, saves time, and reduces costs. Origin offers its customers carefully selected software solutions combined with training and local support to ensure a quick onboarding and a fast return on investment. This makes Origin an ideal partner to offer Altair’s manufacturing and design solutions, including Altair Inspire, Altair Inspire Cast, and Altair Inspire Mold.
“Origin’s experience of working with some of the countries’ leading casting, forming, and injection plastic molding companies will enable Altair to reach a wider audience with its leading engineering simulation technologies,” said Dr Royston Jones, chief technology officer, Altair Product Design and UK country manager, Altair. “Together we will be able to help all manufacturers in the UK and Ireland that join our community to reduce physical testing, cut development time and costs, resolve defects, and improve yield.”
“We are 100 percent focused on simulation solutions for manufacturing that improve design outputs, save time, and reduce cost,” said Rob Shropshire, director, Origin Engineering Solutions. “Altair solutions are perfectly suited for our portfolio as we seek to work with partners that share common values around being forward thinking and innovative. Reselling and supporting the Altair solutions is a natural choice. We look forward to building a longstanding relationship with the team at Altair that is mutually beneficial for ourselves and the customers we serve.”
Share on:
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.