Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Now Playing: ‘Predicting Reliability in Electronics’ Presented by the Experts at GEN3
November 17, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electro-chemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The first episode can be viewed in just over eight minutes. Viewers will be given an introduction to SIR and ECM, including objectives, why we use standards, and why “objective evidence” should be used in place of “cleaning.”
Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for “Objective Evidence” and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive, or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
Caught in the ESG Crossfire: Transparency, Comparability, and Impact
10/31/2025 | Marina Hornasek-Metzl, AT&S AGIn the evolving landscape of corporate responsibility, Environmental, Social, and Governance (ESG) reporting has become a cornerstone of stakeholder communication. Yet, as organizations strive to meet growing regulatory and investor demands, they find themselves caught between the need for robust ESG disclosure, the persistent lack of comparability across reports, and the elusive goal of translating ESG efforts into tangible business value.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.
Fall 2025 Issue of Community Magazine Now Available
10/20/2025 | I-Connect007Now available! The Fall 2025 issue of Community Magazine delivers another stellar issue packed with member profiles, workforce development and sustainability wins, policy updates, factory data standards, personality features, news from around the world, and much more..
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.