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Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)
November 24, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over 8 minutes, the ninth episode, “AI in Action” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit “Converting Process Data Into Intelligence” and start watching, free, today!
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.
The Art and Science of PCB Floor Planning: A Comprehensive Guide
08/14/2025 | Cory Grunwald and Jeff Reinhold, Monsoon SolutionsPCB design is an intricate and crucial part of developing electronic products. One of the foundational stages of PCB design is floor planning, a phase where the placement of components and the flow of signals are meticulously mapped out. A good floor plan ensures that the PCB performs well, is easy to manufacture, and meets all mechanical and electrical requirements. We’ll explore the essential aspects of floor planning, from its objectives and process to the challenges that designers face.
Advint and SanRex Expand High-Performance DC Rectifier Access for North American PCB Fabricators
08/12/2025 | Advint IncorporatedAdvint Incorporated has entered a strategic partnership with SanRex Corporation, enhancing access to industrial-grade DC rectifiers for the US printed circuit board industry. With a legacy of power innovation and performance across the globe, SanRex rectifiers are available through Advint’s proficient distribution network.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.