-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
SMTA Seeks Donations for Hutchins Grant and Stromberg Scholarship
December 1, 2021 | SMTAEstimated reading time: Less than a minute
The SMTA is seeking donations for the Charles Hutchins Grant and JoAnn Stromberg Student Leader Scholarship for the upcoming year. Both of these awards are made possible exclusively through donations by businesses and individuals.
The Hutchins Grant has been awarded annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronics manufacturing, electronics packaging, or a related field. Similarly, the Stromberg Scholarship is awarded annually to a student pursuing a degree in electronics (or surrounding industry) and actively involved in the SMTA. Recipients are able to use the funds for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary.
Through the generosity shown by dedicated members and chapters, the SMTA is able to continue its mission and help to inspire the next generation of engineers. Every gift helps and donations of all sizes are welcome – whether it's a one-time gift or a monthly contribution.
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
07/02/2025 | BUSINESS WIREEiyu Electronics Co., Ltd., a Hong Kong-based electronic component trading company, today announced the official launch of its pre-assembled module product line, designed to help engineers and procurement teams save time when sourcing complex modular components.
Kitron Receives EUR 4 Million Contract for Defense Airborne Radar Application
07/02/2025 | KitronKitron has received an order valued at EUR 4 million to produce electronics modules for airborne radar application, destined for the US market.
Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
07/02/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, is proud to announce that David Smith is celebrating 10 years with the company this month.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.