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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Isola Materials Support Military LEO Satellites
December 7, 2021 | IsolaEstimated reading time: 1 minute
Isola Group, a global innovator in materials for printed circuit boards (PCBs), has announced its low-loss I-Tera® MT40 circuit materials supporting multilayer printed circuit boards (PCBs) for military- and commercial-grade low-Earth-orbit (LEO) satellites. The laminates and prepreg materials are suitable for high-density-interconnect (HDI) multilayer assemblies that must meet demanding military size, weight, and power (SWaP) requirements for LEO satellite payloads. The circuit materials are available in the form of I-Tera MT40 laminates and prepreg materials for high-speed-digital (HSD) circuit applications and I-Tera MT40 (RF/MW) laminates for high-frequency RF and microwave (MW) circuits through W-band frequencies.
Straightforward processing methods and manufacturing steps are used to fabricate single-, dual-, and multilayer circuits as well as HDI builds with I-TERA MT40 circuit materials in contrast to the complex and lengthy PCB fabrication processes required with other commonly used high-speed/high-frequency circuit materials such as PTFE. The ease of manufacturing reduces wear on machine tools, fabrication time, and assembly costs.
I-TERA MT40 (RF/MW) laminates maintain a dielectric constant (Dk) of 3.38, 3.45, 3.60, and 3.75 in the z-axis (thickness). The Dk remains stable over a wide temperature range, from -40 to +140°C. The laminates feature low loss at high frequencies, with a dissipation factor (Df) as low as 0.0028. They do not require any special thruhole treatments when forming multilayer circuits and HDIs, and support both HSD, RF/MW, and hybrid mixed-signal circuits. Laminates and prepregs are available in standard thicknesses and panel sizes, with standard copper weights of 0.5 to 2.0 oz. (and custom weights), with the light weight and durability required for critical military LEO satellite payloads.
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.