-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
EMS Leadership Summit at IPC APEX EXPO 2022 Brings Together Current and Future Industry Leaders
December 8, 2021 | IPCEstimated reading time: 1 minute
New and experienced managers will gather at the EMS Leadership Summit at IPC APEX EXPO on January 24, 2022, to discuss strategies for advancing the industry and enhancing leadership skills.
Industry experts and innovators will lead discussions on a wide range of topics for managing EMS companies in the current climate. Representatives from Ascentron, Avnet, Calumet Electronics, e1ectr0n, Lincoln Partners, Spartronics, TTI, Inc, TTM Technologies, Inc., Zentech and IPC will provide critical insight on how best to move forward when presented with the industry’s toughest challenges.
Attendees will gain insight into the economic outlook for the EMS industry, along with receiving updates on supply chain issues, CMMC implementation, selecting and using quoting software, robotic automation, and the latest information on mergers and acquisitions. Roundtables will provide an opportunity to network and discuss the most pertinent issues facing EMS leaders.
“The EMS Leadership Summit provides a unique opportunity for EMS leaders to identify common opportunities and challenges and to discuss solutions with peers,” said Tracy Riggan, senior director, business development at IPC. “This collaboration allows new and seasoned EMS leaders to build knowledge that they can take back to their companies and share with their staff.”
To further the value of the meeting and encourage sharing of educational opportunities beyond leadership, attendees of the EMS Leadership Summit will receive a $200 voucher for IPC EDGE or $600 if they bring a colleague.
To register for the EMS Leadership Summit or for more information on all the activities taking place at IPC APEX EXPO, including the technical conference, professional development courses, networking activities, and online exhibition, visit www.ipcapexexpo.org.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.