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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 10, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Right now, it seems that almost everyone I know is talking about the future. Doesn’t matter whether it’s with my family, loved ones, friends, industry colleagues, or neighbors I meet on the street, conversations are almost entirely forward-looking. This being the holiday season, some reminiscing is to be expected, but I’m just not hearing it in the chatter all around me–this year is different somehow. And it shows in this edition of my must-reads for the week as well.
This week we bring you forward-looking discussions with Dr. John Mitchell, IPC president and CEO, on IPC APEX EXPO and what to expect in the future; and an interview with Isola’s CEO, Travis Kelly, introducing a new industry consortium, the Printed Circuit Board Association of America. Innovative additive technologies gain the spotlight as well, with Nano Dimension and a combination of Averatek and American Standard Circuits leading this week’s news cycle. Wrapping up the theme is Siemens’ position as a visionary in the Industrial IoT Magic Quadrant, as compiled by Gartner.
The Mission of the New Printed Circuit Board Association of America
Published December 9
Barry Matties recently met with Travis Kelly to discuss the formation of the Printed Circuit Board Association of America (PCBAA), a consortium of U.S.-based companies he chairs to support U.S. domestic production of PCBs. PCBAA was established on three pillars, and Travis explains how they intertwine with each other—and with other similar organizations in the industry. This is an important read no matter what sector of the industry you fall in.
John Mitchell: Focus on the Future
Published December 6
In a far-ranging interview, first published in I-Connect007’s December issue of SMT007 Magazine, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges–and opportunities–facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong.
Nano Dimension Sells Two DragonFly IV 3D-AME Systems to Defense and Government Agencies
Published December 6
Nano Dimension announced that it has sold the first two DragonFly IV 3D-AME printers, in addition to the two machines that have completed beta sites processes with other leading customers. DragonFly IV is an additive manufacturing system for fabrication of electronic devices which deposits materials while concurrently integrating capacitors, antennas, coils, transformers, and electro-mechanical components.
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
Published December 7
Siemens Digital Industries Software announced it has been positioned by Gartner in the Visionaries Quadrant of the Gartner Magic Quadrant for Industrial IoT platforms. Siemens is positioned as the sole vendor in the “Visionaries” Quadrant in the report on its first participation in the research. Gartner describes Visionaries in a market as the innovators that drive the market forward by responding to emerging, leading-edge customer demands and by offering new opportunities to excel.
American Standard Circuits Utilizes Averatek Process for Medical Technology
Published December 6
CEO Anaya Vardya discusses the addition of the Averatek A-SAP™ to ASC’s offerings. In the news item, Vardya explains, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.”
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.