Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
SAP Certifies Zuken Interface for S/4HANA
December 14, 2021 | ZukenEstimated reading time: 1 minute
Zuken, a global technology leader in digital engineering for electronic and electrical systems, announces the release of the "SAP Engineering Control Center interface to Zuken." This new interface enables the integration of its CR-8000/DS-CR and E3.series/DS-E3 engineering systems into SAP S/4HANA, SAP's latest-generation ERP system.
The interface supports a bidirectional exchange of material master data and documents as well as CAD data and product structure information between Zuken's electronic and electrical engineering systems, CR-8000/DS-CR and E3.series/DS-E3, and SAP S/4HANA. The integration enables data and metadata generated in Zuken’s tools to be used in company-wide business processes managed in SAP, such as concurrent engineering, module management, configuration management, component management, and change and release management.
In detail, the integration supports the following processes in both the Zuken and SAP domains:
- Creation and exchange of component master data
- Release of approved components and blocking of discontinued components
- Exchange of manufacturing data, metadata, and parts lists between Zuken and SAP
- Optional creation and alignment of product structures
- Control of workflow and change processes
The certified interface is based on the SAP Engineering Control Center | SAP ECTR software product developed by SAP Platinum Partner, DSC SOFTWARE AG, based in Karlsruhe, Germany. This is SAP's standard integration platform for MCAD, ECAD and MS Office in SAP PLM. Following the successful certification through SAP, the Zuken interface is now available for purchase from SAP.
"The certification and addition of the SAP Engineering Control Center interface for Zuken to the SAP price list represents an additional element of investment security for our customers in a rapidly changing IT world,” said Oliver Hechtl, Zuken Head of Technology and Services Europe. "It provides our customers with the assurance that engineering data and information generated in Zuken's best-in-class engineering software can be leveraged to support cross-enterprise digital business processes."
Dominik Maier, Senior Vice President Products & Development and Authorized Signatory, of DSC added: “The direct integration for Zuken is another important milestone on the SAP ECTR roadmap. It demonstrates our continued commitment to expanding the integration capabilities of SAP ECTR, and, consequently SAP PLM, together with SAP and other key partners. We are very pleased that Zuken users can now take full advantage of the SAP ECTR direct integration.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.