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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy

10/26/2026 | Global Electronics Association
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris, a provider of engineering intelligence and electronic-component data.

Cadence Unveils Maestro AI Model Portfolio to Advance Agentic Chip and System Design

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Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

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Arda Emerges from Stealth to Speed Up American Manufacturing

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Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.
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