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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 14, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

We’re driving headlong into 2022, and there’s a lot going on in the world of PCB design, fabrication, and assembly. It’s trade show season now. IPC APEX EXPO starts in less than two weeks, and we’re all getting ready for what is, for many, the first trade show in years. Do you know where you put your business cards after your last show in 2020? I keep half a box of biz cards in my glove compartment; I’m not going to make that mistake again.
Trade shows are well represented in this week’s Top Five, along with news about a new Isola eBook on advanced materials and an article on the Factory of the Future. I imagine you’ll find more information about high-performance materials and the Smart Factory at IPC APEX EXPO.
I hope to see you all in San Diego, but if you can’t make it, check in with I-Connect007 throughout the week for the latest show updates.
New Book From Isola Highlights Importance of Material Selection
Published January 13
The latest I-007eBook, The Printed Circuit Designer’s Guide to... High Performance Materials, authored by Isola’s Michael Gay, provides PCB designers and design engineers with guidelines for selecting the proper advanced material for each application. This free eBook can help you weave your way through the maze of available high-performance materials available now.
CES 2022: Half Virtual, Still Valuable, and Here’s Why
Published January 13
Consumer Editor Dan Feinberg has been covering the changing technology at CES for over a decade. But this year, Dan is covering the show virtually, and apparently, about half of the usual attendees also decided to log into the show instead of traveling to Las Vegas. Still, as Dan explains in this post-show review, there was plenty of innovation on display at this year’s CES.
AltiumLive 2022 CONNECT Announces European Summit Dates
Published January 13
Altium has announced the dates for its European AltiumLive event, February 2-4, 2022. Taking place one week after its U.S. counterpart, the European Summit will also be a virtual affair, with tracks including Design Principles and Practices; Simulation, Test & Measurement; Supply Chain; Manufacturing, and classes devoted to Altium tools. Registration for the European AltiumLive is open now.
Making the Most of a Smart Factory Initiative
Published January 11
In this conversation from the January issue of SMT007 Magazine, Editor Nolan Johnson speaks with Koh Young’s Joel Scutchfield about the company’s focus on the Smart Factory Initiative. They also discuss trends in the global market, including artificial intelligence, predictive maintenance, and data analytics.
Happy Holden’s Five Must-Reads of 2021
Published January 10
As we entered 2022, we asked Happy Holden to review the articles that we published last year and pick his Top Five. Always up for a challenge, Happy went through our 2021 offerings and named his five favorites, along with his criteria for selecting them. We hope you enjoy this insight into the kind of articles that Happy finds interesting.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.