-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Dixon, Rexxam Sign JV Agreement
January 21, 2022 | DixonEstimated reading time: Less than a minute
Dixon has entered into Joint Venture Agreement (JV Agreement) with Rexxam Co. Ltd. (Rexxam). Pursuant to the said JV Agreement, Dixon Devices Private Limited (JV Company) will be 40% owned by Dixon and 60% owned by Rexxam. The JV Company has received approval under PLI scheme of Government of India under White Goods category and in accordance with the same, it will undertake manufacturing of Printed Circuit Boards for Air-Conditioners (PCBA) for the domestic and international market.
Commenting on this occasion, Atul B. Lall, Vice Chairman & Managing Director, stated that “We are immensely grateful by the trust that Rexxam has bestowed on Dixon for this collaboration. Through this partnership, we are taking a leap in our long standing relationship of 7 years with Rexxam. The JV Company will cater to customers of Rexxam for both domestic and export markets. With Dixon’s excellent record of manufacturing and Rexxam taking the lead in marketing and sales, we are positive that this partnership will be well-positioned and a key player in this space and shall be a contributor in strengthening India’s electronics manufacturing sector as well as towards Indian government’s vision of an Atmanirbhar Bharat”.
Suggested Items
Delta Electronics, Cal-Comp Strengthen Partnership to Drive Innovation in Industrial Automation
12/25/2024 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions, and Cal-Comp Electronics (Thailand) Public Company Limited (SET Ticker: CCET), a leading industry 4.0+ electronics manufacturing services (EMS) provider, have signed a Memorandum of Understanding (MOU) to deepen their collaboration in industrial automation.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Delta Honored as Top 10 Best Taiwan Global Brands
12/23/2024 | Delta ElectronicsDelta, a global leader in power management and a provider of IoT-based smart green solutions, was selected as one of the “2024 Best Taiwan Global Brands” for the 14th year in a row, ranking among Taiwan's top 10 global brands.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.