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Dixon, Rexxam Sign JV Agreement
January 21, 2022 | DixonEstimated reading time: Less than a minute

Dixon has entered into Joint Venture Agreement (JV Agreement) with Rexxam Co. Ltd. (Rexxam). Pursuant to the said JV Agreement, Dixon Devices Private Limited (JV Company) will be 40% owned by Dixon and 60% owned by Rexxam. The JV Company has received approval under PLI scheme of Government of India under White Goods category and in accordance with the same, it will undertake manufacturing of Printed Circuit Boards for Air-Conditioners (PCBA) for the domestic and international market.
Commenting on this occasion, Atul B. Lall, Vice Chairman & Managing Director, stated that “We are immensely grateful by the trust that Rexxam has bestowed on Dixon for this collaboration. Through this partnership, we are taking a leap in our long standing relationship of 7 years with Rexxam. The JV Company will cater to customers of Rexxam for both domestic and export markets. With Dixon’s excellent record of manufacturing and Rexxam taking the lead in marketing and sales, we are positive that this partnership will be well-positioned and a key player in this space and shall be a contributor in strengthening India’s electronics manufacturing sector as well as towards Indian government’s vision of an Atmanirbhar Bharat”.
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Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Benchmark Announces Appointment of Chuck Swoboda to Board of Directors
08/05/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the appointment of Charles “Chuck” Swoboda to its Board of Directors.
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit
08/05/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has successfully completed its 2025 ISO 13485:2016 surveillance audit at the company’s Cranston, Rhode Island facility.
Report: Green Electronics Market to Hit $46.53B by 2029
08/05/2025 | Globe NewswireAccording to the Green Electronics Manufacturing Market Report 2025, this sector will grow from $16.81 billion in 2024 to $20.66 billion in 2025 at a compound annual growth rate (CAGR) of 22.9%.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.