Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 21, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Next week, we’ll be in San Diego. In fact, I fly down tomorrow morning to start preparations, along with most of the I-Connect007 team. The weather forecast says to expect sunny, with the occasional cloud, all week, with daytime temperatures around 70 degrees. That’ll be nice, as I’m sure COVID-related social distancing guidelines will encourage us to socialize outside as much as is feasible.
Don’t get me wrong, the team is very excited to be covering the IPC APEX EXPO week in-person. We’ll be practicing our exposure minimization and proper social distancing as best as we can, however. We will also be covering the virtual AltiumLive event, which overlaps with IPC APEX EXPO. Expect to see Andy Shaughnessy and other I-Connect007 faces reporting on both events next week.
Andy and I have been creating these must-read lists since June of 2020, five months after the last in-person IPC APEX EXPO—yes, it’s been that long! So, this is the first of our five must-reads covering the lead-up week to a physical show. No surprise then that reader interest has been somewhat APEX- and AltiumLive-centric this week. Here are the top five standouts from a busy, busy week of news.
Best Technical Papers at IPC APEX EXPO 2022 Selected
Published January 14
In the article, IPC Chief Technologist, Matt Kelly, says, ““The [Technical Program Committee] is absolutely focused on providing highest quality content to the technical conference. This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners." Click through to see who those award recipients are.
Booming Semiconductors: AT&S Shaping Coming Data Revolution
Published January 17
This news piece updates readers on what AT&S presented for latest latest developments in the field of IC substrates at the Consumer Electronics Show CES in Las Vegas. Substrates are key to the semiconductor chips that get placed on the printed circuit boards; keeping up on the latest in semiconductor substrates just makes sense.
Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions
Published January 17
I-Connect007 speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.
Mycronic to Demonstrate Enhanced Process Control Solutions for Flexible PCB Assembly at IPC APEX EXPO
Published January 19, 2022
From the press release, “Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.” Click through to read more.
MacDermid Alpha’s Electrolube to Present Two Keynotes on Resins and Coatings at IPC APEX EXPO
Published January 20
Phil Kinner, global business and technical director for Electrolube’s Coatings Division, and Beth Turner, Electrolube’s senior technical manager, will both present papers at the event. Kinner’s is titled “Conformal Coatings: State of the Industry Versus State of the Art,” and Turner’s is titled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment.” Click through for more details.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.