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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 21, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Next week, we’ll be in San Diego. In fact, I fly down tomorrow morning to start preparations, along with most of the I-Connect007 team. The weather forecast says to expect sunny, with the occasional cloud, all week, with daytime temperatures around 70 degrees. That’ll be nice, as I’m sure COVID-related social distancing guidelines will encourage us to socialize outside as much as is feasible.
Don’t get me wrong, the team is very excited to be covering the IPC APEX EXPO week in-person. We’ll be practicing our exposure minimization and proper social distancing as best as we can, however. We will also be covering the virtual AltiumLive event, which overlaps with IPC APEX EXPO. Expect to see Andy Shaughnessy and other I-Connect007 faces reporting on both events next week.
Andy and I have been creating these must-read lists since June of 2020, five months after the last in-person IPC APEX EXPO—yes, it’s been that long! So, this is the first of our five must-reads covering the lead-up week to a physical show. No surprise then that reader interest has been somewhat APEX- and AltiumLive-centric this week. Here are the top five standouts from a busy, busy week of news.
Best Technical Papers at IPC APEX EXPO 2022 Selected
Published January 14
In the article, IPC Chief Technologist, Matt Kelly, says, ““The [Technical Program Committee] is absolutely focused on providing highest quality content to the technical conference. This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners." Click through to see who those award recipients are.
Booming Semiconductors: AT&S Shaping Coming Data Revolution
Published January 17
This news piece updates readers on what AT&S presented for latest latest developments in the field of IC substrates at the Consumer Electronics Show CES in Las Vegas. Substrates are key to the semiconductor chips that get placed on the printed circuit boards; keeping up on the latest in semiconductor substrates just makes sense.
Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions
Published January 17
I-Connect007 speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.
Mycronic to Demonstrate Enhanced Process Control Solutions for Flexible PCB Assembly at IPC APEX EXPO
Published January 19, 2022
From the press release, “Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.” Click through to read more.
MacDermid Alpha’s Electrolube to Present Two Keynotes on Resins and Coatings at IPC APEX EXPO
Published January 20
Phil Kinner, global business and technical director for Electrolube’s Coatings Division, and Beth Turner, Electrolube’s senior technical manager, will both present papers at the event. Kinner’s is titled “Conformal Coatings: State of the Industry Versus State of the Art,” and Turner’s is titled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment.” Click through for more details.
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Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.